Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7901956 | Structure for bumped wafer test | Francis Heap Hoe Kuan, Byung Tai Do | 2011-03-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7901956 | Structure for bumped wafer test | Francis Heap Hoe Kuan, Byung Tai Do | 2011-03-08 |