Issued Patents 2011
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7923295 | Semiconductor device and method of forming the device using sacrificial carrier | Il Kwon Shim, Yaojian Lin | 2011-04-12 |
| 7923846 | Integrated circuit package-in-package system with wire-in-film encapsulant | Byung Tai Do, Heap Hoe Kuan, Linda Pei Ee Chua, Rui Huang | 2011-04-12 |
| 7902644 | Integrated circuit package system for electromagnetic isolation | Rui Huang, Byung Tai Do, Heap Hoe Kuan | 2011-03-08 |
| 7888184 | Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof | Il Kwon Shim, Heap Hoe Kuan, Seung Uk Yoon, Jong-Woo Ha | 2011-02-15 |
| 7871862 | Ball grid array package stacking system | Lionel Chien Hui Tay | 2011-01-18 |
| 7872345 | Integrated circuit package system with rigid locking lead | Linda Pei Ee Chua, Heap Hoe Kuan | 2011-01-18 |
| 7868434 | Integrated circuit package-on-package stacking system | Dioscoro A. Merilo, Heap Hoe Kuan, You Yang Ong, Ma. Shirley Asoy | 2011-01-11 |
| 7863099 | Integrated circuit package system with overhanging connection stack | Byung Tai Do | 2011-01-04 |
| 7863732 | Ball grid array package system | Lionel Chien Hui Tay | 2011-01-04 |
| 7863730 | Array-molded package heat spreader and fabrication method therefor | Il Kwon Shim, Kambhampati Ramakrishna, Diane Sahakian, Dario S. Filoteo, Jr., Virgil Ararao | 2011-01-04 |
| 7863726 | Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof | Tae Hoan Jang | 2011-01-04 |
| 7863109 | Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof | Rui Huang, Heap Hoe Kuan | 2011-01-04 |
| 7863102 | Integrated circuit package system with external interconnects within a die platform | Lionel Chien Hui Tay | 2011-01-04 |