Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7888184 | Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof | Il Kwon Shim, Seng Guan Chow, Heap Hoe Kuan, Jong-Woo Ha | 2011-02-15 |