Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008121 | Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate | DaeSik Choi, Jongho Kim | 2011-08-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008121 | Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate | DaeSik Choi, Jongho Kim | 2011-08-30 |