Issued Patents 2005
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979248 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Rashid Mavliev +2 more | 2005-12-27 |
| 6977036 | Method and apparatus for substrate polishing | Ralph Wadensweiler, Alain Duboust, Manoocher Birang, Ratson Morad, Paul D. Butterfield | 2005-12-20 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Yonqi Hu, Antoine P. Manens, Rashid Mavliev, Stan Tsai +5 more | 2005-11-08 |
| 6905965 | Reactive preclean prior to metallization for sub-quarter micron application | Suchitra Subrahmanyan, Roderick C. Mosely | 2005-06-14 |
| 6899804 | Electrolyte composition and treatment for electrolytic chemical mechanical polishing | Alain Duboust, Lizhong Sun, Feng Q. Liu, Yuchun Wang, Yan Wang +1 more | 2005-05-31 |
| 6896776 | Method and apparatus for electro-chemical processing | Wei-Yung Hsu, Ratson Morad, Daniel Carl, Sasson Somekh | 2005-05-24 |
| 6893548 | Method of conditioning electrochemical baths in plating technology | Robin Cheung, Daniel Carl, Yezdi Dordi, Paul Smith, Ratson Morad +2 more | 2005-05-17 |
| 6884724 | Method for dishing reduction and feature passivation in polishing processes | Wei-Yung Hsu, Ratson Morad, Daniel Carl | 2005-04-26 |
| 6869498 | Chemical mechanical polishing with shear force measurement | Stan Tsai, Rashid Mavliev | 2005-03-22 |
| 6863797 | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP | Lizhong Sun, Feng Q. Liu, Siew Neo, Stan Tsai | 2005-03-08 |
| 6848970 | Process control in electrochemically assisted planarization | Antoine P. Manens | 2005-02-01 |
| 6841057 | Method and apparatus for substrate polishing | Ralph Wadensweiler, Alain Duboust, Manoocher Birang, Ratson Morad, Paul D. Butterfield | 2005-01-11 |
| 6837983 | Endpoint detection for electro chemical mechanical polishing and electropolishing processes | Alain Duboust, Yan Wang, Siew Neo | 2005-01-04 |