Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6962524 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2005-11-08 |
| 6869498 | Chemical mechanical polishing with shear force measurement | Rashid Mavliev, Liang-Yuh Chen | 2005-03-22 |
| 6863794 | Method and apparatus for forming metal layers | Shijian Li | 2005-03-08 |
| 6863797 | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP | Lizhong Sun, Feng Q. Liu, Siew Neo, Liang-Yuh Chen | 2005-03-08 |
| 6858540 | Selective removal of tantalum-containing barrier layer during metal CMP | Lizhong Sun, Shijian Li, Fred C. Redeker | 2005-02-22 |