Issued Patents 2005
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6960521 | Method and apparatus for polishing metal and dielectric substrates | Yongsik Moon, David H. Mai, Kapila Wijekoon, Rajeev Bajaj, Rahul Surana +6 more | 2005-11-01 |
| 6921494 | Backside etching in a scrubber | Brian J. Brown, Madhavi R. Chandrachood, Radha Nayak, Michael Sugarman, John M. White | 2005-07-26 |
| 6872329 | Chemical mechanical polishing composition and process | Yuchun Wang, Rajeev Bajaj, Shijian Li | 2005-03-29 |
| 6869332 | Chemical mechanical polishing of a metal layer with polishing rate monitoring | Rajeev Bajaj | 2005-03-22 |
| 6864181 | Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition | John M. Boyd | 2005-03-08 |
| 6863593 | Chemical mechanical polishing a substrate having a filler layer and a stop layer | Raymond R. Jin, Shijian Li, Thomas H. Osterheld | 2005-03-08 |
| 6858540 | Selective removal of tantalum-containing barrier layer during metal CMP | Lizhong Sun, Stan Tsai, Shijian Li | 2005-02-22 |
| 6858265 | Technique for improving chucking reproducibility | Robert Steger, Shijian Li | 2005-02-22 |
| 6855043 | Carrier head with a modified flexible membrane | Jianshe Tang, Brian J. Brown, Charles C. Garretson, Benjamin A. Bonner, Thomas H. Osterheld | 2005-02-15 |