Issued Patents 2005
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6979248 | Conductive polishing article for electrochemical mechanical polishing | Yongqi Hu, Yan Wang, Alain Duboust, Rashid Mavliev, Liang-Yuh Chen +2 more | 2005-12-27 |
| 6962524 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2005-11-08 |
| 6899804 | Electrolyte composition and treatment for electrolytic chemical mechanical polishing | Alain Duboust, Lizhong Sun, Yuchun Wang, Yan Wang, Siew Neo +1 more | 2005-05-31 |
| 6863797 | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP | Lizhong Sun, Siew Neo, Stan Tsai, Liang-Yuh Chen | 2005-03-08 |
| 6849696 | Low dielectric constant organic dielectrics based on cage-like structures | Kreisler Lau, Boris Korolev, Emma Brouk, Roger Leung | 2005-02-01 |