Issued Patents 2005
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6962524 | Conductive polishing article for electrochemical mechanical polishing | Paul D. Butterfield, Liang-Yuh Chen, Yonqi Hu, Antoine P. Manens, Rashid Mavliev +5 more | 2005-11-08 |
| 6899804 | Electrolyte composition and treatment for electrolytic chemical mechanical polishing | Alain Duboust, Lizhong Sun, Feng Q. Liu, Yuchun Wang, Yan Wang +1 more | 2005-05-31 |
| 6863797 | Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP | Lizhong Sun, Feng Q. Liu, Stan Tsai, Liang-Yuh Chen | 2005-03-08 |
| 6837983 | Endpoint detection for electro chemical mechanical polishing and electropolishing processes | Alain Duboust, Yan Wang, Liang-Yuh Chen | 2005-01-04 |