Issued Patents All Time
Showing 26–50 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10658282 | Package substrate structure and bonding method thereof | Cheng-Ta Ko, Kai-Ming Yang, Tzyy-Jang Tseng | 2020-05-19 |
| 10651358 | Light emitting device package structure with circuit redistribution structure and manufacturing method thereof | Pei-Wei Wang, Cheng-Ta Ko, De-Shiang LIU, Tzyy-Jang Tseng | 2020-05-12 |
| 10588214 | Stacked structure and method for manufacturing the same | Tzyy-Jang Tseng, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko | 2020-03-10 |
| 10324370 | Manufacturing method of circuit substrate and mask structure and manufacturing method thereof | Pu-Ju Lin, Shih-Lian Cheng, Cheng-Ta Ko, Jui-Jung Chien, Wei-Tse Ho | 2019-06-18 |
| 10211139 | Chip package structure | Tzyy-Jang Tseng, Ra-Min Tain | 2019-02-19 |
| 10141224 | Manufacturing method of interconnection structure | Dyi-Chung Hu, Yin-Po Hung, Ra-Min Tain | 2018-11-27 |
| 10083901 | Method for manufacturing circuit redistribution structure | Cheng-Ta Ko | 2018-09-25 |
| 10068847 | Package substrate and method of fabricating the same | Wei-Chung Lo, Dyi-Chung Hu, Chang-Hong Hsieh | 2018-09-04 |
| 9970519 | Circulation member positioning structure for ball screw | Ming-Yao Lin, Hui-Chen Chen, Tsung-Hsien Tsai | 2018-05-15 |
| 9887153 | Circuit redistribution structure unit and method for manufacturing circuit redistribution structure | Cheng-Ta Ko | 2018-02-06 |
| 9859159 | Interconnection structure and manufacturing method thereof | Dyi-Chung Hu, Yin-Po Hung, Ra-Min Tain | 2018-01-02 |
| 9860980 | Circuit board element | Yu-Chung Hsieh, Chun-Hsien Chien, Wei-Ti Lin | 2018-01-02 |
| 9854671 | Circuit board and method of manufacturing the same | Wei-Ti Lin, Chun-Hsien Chien, Yu-Chung Hsieh | 2017-12-26 |
| 9737607 | Polymer, and pharmaceutical composition employing the same | Jui-Hsiang Chen, Chia-Chen Tsai, Tse-Min Teng, Ting-Yu Shih, Chia-Chun Wang +6 more | 2017-08-22 |
| 9601474 | Electrically stackable semiconductor wafer and chip packages | Shou-Lung Chen, Ching-Wen Hsaio, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2017-03-21 |
| 9578742 | Circuit board structure and method for manufacturing the same | Shih-Liang Cheng, Dyi-Chung Hu | 2017-02-21 |
| 9485874 | Package substrate having photo-sensitive dielectric layer and method of fabricating the same | Wei-Chung Lo, Dyi-Chung Hu, Chang-Hong Hsieh | 2016-11-01 |
| D768945 | Anti-mildew and antiseptic sticker | — | 2016-10-11 |
| 9368442 | Method for manufacturing an interposer, interposer and chip package structure | Ra-Min Tain, Dyi-Chung Hu | 2016-06-14 |
| 9302151 | Bowed stringed instrument bowing exercise apparatus and manufacturing method thereof | Cheng-Hsiung Lin, Yung-Yu Lin, Kae Han | 2016-04-05 |
| 9059181 | Wafer leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsaio, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2015-06-16 |
| 8968765 | Brush polymer and medical use thereof | Jui-Hsiang Chen, Jean-Dean Yang, Ting-Yu Shih, Chia-wei Hong, Chao-Chen Tien | 2015-03-03 |
| 8915634 | Plane light source and flexible plane light source | Chao-Kai Hsu, Wei-Chung Lo | 2014-12-23 |
| 8777437 | Light-emitting module | Zhi-Cheng Hsiao, Chao-Kai Hsu | 2014-07-15 |
| 8587091 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsiao, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2013-11-19 |