Issued Patents All Time
Showing 51–66 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8513532 | Flexible circuit structure with stretchability and method of manufacturing the same | Ying-Ching Shih | 2013-08-20 |
| 8425931 | Biodegradable hyaluronic acid derivative | Jui-Hsiang Chen, Bin-Hong Tsai, Hsuen-Tseng Chang, Muh-Lan Chen, Shu-Hua Jan +1 more | 2013-04-23 |
| 8313765 | Biodegradable hyaluronic acid derivative, biodegradable polymeric micelle composition and pharmaceutical or bioactive composition | Jui-Hsiang Chen, Bin-Hong Tsai, Hsuen-Tseng Chang, Muh-Lan Chen, Shu-Hua Jan +1 more | 2012-11-20 |
| 8314482 | Semiconductor package device | Shou-Lung Chen, Ching-Wen Hsiao, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2012-11-20 |
| 8304666 | Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof | Cheng-Ta Ko, Min-Lin Lee, Wei-Chung Lo, Shur-Fen Liu, Jinn-Shing King +1 more | 2012-11-06 |
| 8269112 | Flexible circuit structure | Yuan-Chang Lee, Ying-Ching Shih, Cheng-Ta Ko | 2012-09-18 |
| 7838333 | Electronic device package and method of manufacturing the same | Shou-Lung Chen, Ching-Wen Hsiao, Jeng-Dar Ko, Jyh-Rong Lin | 2010-11-23 |
| 7780982 | Biodegradable hyaluronic acid derivative and biodegradable polymeric micelle composition | Jui-Hsiang Chen, Bin-Hong Tsai, Hsuen-Tseng Chang, Muh-Lan Chen, Shu-Hua Jan +1 more | 2010-08-24 |
| 7763895 | Flexible light source device and fabrication method thereof | Zhi-Cheng Hsiao, Chao-Kai Hsu | 2010-07-27 |
| 7655258 | Biodegradable copolymer, and polymeric micelle composition containing the same | Bin-Hong Tsai, Jui-Hsiang Chen, Muh-Lan Chen, Mei-Jung Liu | 2010-02-02 |
| 7632707 | Electronic device package and method of manufacturing the same | Shou-Lung Chen, Ching-Wen Hsiao, Jeng-Dar Ko, Jyh-Rong Lin | 2009-12-15 |
| 7528009 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsiao, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2009-05-05 |
| 7294920 | Wafer-leveled chip packaging structure and method thereof | Shou-Lung Chen, Ching-Wen Hsiao, Jeng-Dar Ko, Chih-Ming Tzeng, Jyh-Rong Lin +1 more | 2007-11-13 |
| 7163885 | Method of migrating and fixing particles in a solution to bumps on a chip | Yu-Chih Chen, Ruoh-Huey Uang | 2007-01-16 |
| 6989325 | Self-assembled nanometer conductive bumps and method for fabricating | Ruoh-Huey Uang | 2006-01-24 |
| 4864087 | Burglar alarm including a reed relay actuated in response to a vibrating magnet to produce an alarm signal | — | 1989-09-05 |