Issued Patents All Time
Showing 26–50 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101173 | Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same | Jeffrey Smith, Kandabara Tapily, Angelique Raley, Qiang Zhao | 2021-08-24 |
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Kandabara Tapily +3 more | 2021-06-01 |
| 10964608 | Platform and method of operating for integrated end-to-end gate contact process | — | 2021-03-30 |
| 10923394 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Kandabara Tapily, Kai-Hung Yu | 2021-02-16 |
| 10923392 | Interconnect structure and method of forming the same | Soo Doo Chae, Jeffrey Smith, Gerrit J. Leusink, Kai-Hung Yu | 2021-02-16 |
| 10916472 | Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same | Jeffrey Smith, Kandabara Tapily, Angelique Raley, Qiang Zhao | 2021-02-09 |
| 10886173 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Kandabara Tapily, Kai-Hung Yu | 2021-01-05 |
| 10861744 | Platform and method of operating for integrated end-to-end CMP-less interconnect process | Ying Trickett, Kai-Hung Yu, Nicholas Joy, Kaoru Maekawa | 2020-12-08 |
| 10790156 | Atomic layer etching using a boron-containing gas and hydrogen fluoride gas | Kandabara Tapily | 2020-09-29 |
| 10790149 | Method of forming crystallographically stabilized ferroelectric hafnium zirconium based films for semiconductor devices | Kandabara Tapily | 2020-09-29 |
| 10784175 | Platform and method of operating for integrated end-to-end gate contact process | — | 2020-09-22 |
| 10727057 | Platform and method of operating for integrated end-to-end self-aligned multi-patterning process | Richard A. Farrell, Kandabara Tapily, Angelique Raley, Sophie Thibaut | 2020-07-28 |
| 10541174 | Interconnect structure and method of forming the same | Soo Doo Chae, Jeffrey Smith, Gerrit J. Leusink, Kai-Hung Yu | 2020-01-21 |
| 10522343 | Method of enhancing high-k film nucleation rate and electrical mobility in a semiconductor device by microwave plasma treatment | Kandabara Tapily | 2019-12-31 |
| 10483109 | Self-aligned spacer formation | Kandabara Tapily | 2019-11-19 |
| 10426001 | Processing system for electromagnetic wave treatment of a substrate at microwave frequencies | Ronald Nasman, Mirko Vukovic, Gerrit J. Leusink, Rodney L. Robison | 2019-09-24 |
| 10381448 | Wrap-around contact integration scheme | Kandabara Tapily | 2019-08-13 |
| 10283369 | Atomic layer etching using a boron-containing gas and hydrogen fluoride gas | Kandabara Tapily | 2019-05-07 |
| 10253414 | Liquid phase atomic layer deposition | — | 2019-04-09 |
| 10217825 | Metal-insulator-semiconductor (MIS) contacts and method of forming | Kandabara Tapily | 2019-02-26 |
| 10014213 | Selective bottom-up metal feature filling for interconnects | Kai-Hung Yu, Kandabara Tapily, Gerrit J. Leusink | 2018-07-03 |
| 9978649 | Solid source doping for source and drain extension doping | Steven P. Consiglio, Jeffrey Smith | 2018-05-22 |
| 9899224 | Method of controlling solid phase diffusion of boron dopants to form ultra-shallow doping regions | Steven P. Consiglio, David L. O'Meara | 2018-02-20 |
| 9837304 | Sidewall protection scheme for contact formation | Kandabara Tapily | 2017-12-05 |
| 9607829 | Method of surface functionalization for high-K deposition | Kandabara Tapily | 2017-03-28 |