Issued Patents All Time
Showing 76–100 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10153243 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii | 2018-12-11 |
| 10115685 | Method of manufacturing a semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2018-10-30 |
| 10043774 | Integrated circuit packaging substrate, semiconductor package, and manufacturing method | Yu-Wei Lin, Chen-Shien Chen, Guan-Yu Chen, Tin-Hao Kuo | 2018-08-07 |
| 9953939 | Conductive contacts having varying widths and method of manufacturing same | Yu-Jen Tseng, Chang-Chia Huang, Tin-Hao Kuo, Chen-Shien Chen | 2018-04-24 |
| 9953936 | Semiconductor structure and manufacturing method thereof | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2018-04-24 |
| 9935073 | Semiconductor structure and manufacturing method of the same | Mirng-Ji Lii, Tin-Hao Kuo, Chen-Shien Chen, Yu-Feng Chen, Sheng-Yu Wu | 2018-04-03 |
| 9917035 | Bump-on-trace interconnection structure for flip-chip packages | Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii | 2018-03-13 |
| 9893107 | Semiconductor device with reduced leakage current and fabricating method thereof | Chia-Yu Wei, Hsin-Chi Chen, Ssu-Chiang Weng, Yung-Lung Hsu, Chin-Hsun Hsiao | 2018-02-13 |
| 9824992 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen | 2017-11-21 |
| 9748301 | Semiconductor structure and manufacturing method thereof | Chia-Yu Wei, Chin-Hsun Hsiao, Yi-Hsing Chu, Yung-Lung Hsu, Hsin-Chi Chen | 2017-08-29 |
| 9679862 | Semiconductor device having conductive bumps of varying heights | Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2017-06-13 |
| 9646923 | Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices | Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii | 2017-05-09 |
| 9633965 | Semiconductor structure and manufacturing method of the same | Mirng-Ji Lii, Tin-Hao Kuo, Chen-Shien Chen, Yu-Feng Chen, Sheng-Yu Wu | 2017-04-25 |
| 9625365 | System and method for monitoring particles in solution | Hsin-Chia Ho, Guo-Dung Chen, Wei-En Fu | 2017-04-18 |
| 9583367 | Methods and apparatus for bump-on-trace chip packaging | Chang-Chia Huang, Chen-Shien Chen, Sheng-Yu Wu, Tin-Hao Kuo | 2017-02-28 |
| 9559069 | Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof | Yu-Feng Chen, Chen-Shien Chen, Sheng-Yu Wu, Tin-Hao Kuo | 2017-01-31 |
| 9520379 | Method of forming bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen | 2016-12-13 |
| 9508668 | Conductive contacts having varying widths and method of manufacturing same | Yu-Jen Tseng, Chang-Chia Huang, Tin-Hao Kuo, Chen-Shien Chen | 2016-11-29 |
| 9484317 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2016-11-01 |
| 9435847 | Method for testing special pattern and probe card defect in wafer testing | Shih-Hsien Chang, Kai-Wen Tu, Ching-Ren Cheng | 2016-09-06 |
| 9379151 | Image sensor device with white pixel improvement | Chia-Yu Wei, Yin-Chen Chen, Yung-Lung Hsu, Hsin-Chi Chen | 2016-06-28 |
| 9318458 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen | 2016-04-19 |
| 9219106 | Integrated inductor | Mirng-Ji Lii, Chen-Shien Chen, Ching-Wen Hsiao, Tsung-Ding Wang | 2015-12-22 |
| 9190348 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2015-11-17 |
| 9165796 | Methods and apparatus for bump-on-trace chip packaging | Chang-Chia Huang, Tin-Hao Kuo, Sheng-Yu Wu, Chen-Shien Chen | 2015-10-20 |