Issued Patents All Time
Showing 26–50 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817472 | Anchor structures and methods for uniform wafer planarization and bonding | Chia-Yu Wei, Cheng-Yuan Li, Hsin-Chi Chen, Kuo-Cheng Lee, Hsun-Ying Huang | 2023-11-14 |
| 11791299 | Redistribution layer (RDL) layouts for integrated circuits | Cheng-Yuan Li, Kuo-Cheng Lee, Yun-Wei Cheng | 2023-10-17 |
| 11784198 | Wide channel semiconductor device | Chia-Yu Wei, Fu-Cheng Chang, Hsin-Chi Chen, Ching-Hung Kao, Chia-Pin Cheng +2 more | 2023-10-10 |
| 11715646 | Semiconductor structure and method for forming the same | Jen-Fu Liu, Ming Hung Tseng, Li-Ko Yeh, Hui-Chun Chiang, Cheng-Chieh Wu | 2023-08-01 |
| 11682655 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Tzu-Sung Huang, Tin-Hao Kuo, Hao-Yi Tsai | 2023-06-20 |
| 11664325 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2023-05-30 |
| 11645693 | Complementary consumer item selection | Son Dinh Tran, Larry Davis | 2023-05-09 |
| 11631993 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chita Chuang, Chen-Shien Chen, Ming Hung Tseng, Sen-Kuei Hsu +1 more | 2023-04-18 |
| 11631648 | Bump structure having a side recess and semiconductor structure including the same | Chih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen | 2023-04-18 |
| 11626339 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2023-04-11 |
| 11544900 | Primitive-based 3D building modeling, sensor simulation, and estimation | Xia Li, James Vradenburg Miller, Walter Vincent Dixon | 2023-01-03 |
| 11532662 | Method of forming image sensor device | Chia-Yu Wei, Kuo-Cheng Lee, Hsun-Ying Huang, Hsin-Chi Chen | 2022-12-20 |
| 11502039 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang +1 more | 2022-11-15 |
| 11481998 | Building footprint generation by using clean mask generation and received image data | Walter Vincent Dixon, James Vradenburg Miller | 2022-10-25 |
| 11476843 | Signal receiving device and bias voltage calibration circuit thereof | Ming-Ta Lee | 2022-10-18 |
| 11456263 | Semiconductor structure and method for forming the same | Chia-Yu Wei, Cheng-Yuan Li, Kuo-Cheng Lee, Hsun-Ying Huang, Hsin-Chi Chen | 2022-09-27 |
| 11380721 | Wide channel gate structure | Chia-Yu Wei, Fu-Cheng Chang, Hsin-Chi Chen, Ching-Hung Kao, Chia-Pin Cheng +2 more | 2022-07-05 |
| 11244906 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo +4 more | 2022-02-08 |
| 11227837 | Integrated circuit package and method | Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Tsung-Hsien Chiang, Tzu-Sung Huang | 2022-01-18 |
| 11189743 | Single photon avalanche diode | Chia-Yu Wei, Yu-Ting Kao, Wen-I Hsu, Hsun-Ying Huang, Kuo-Cheng Lee +1 more | 2021-11-30 |
| 11183523 | CMOS image sensor having indented photodiode structure | Chia-Yu Wei, Hsin-Chi Chen, Kuo-Cheng Lee, Ping-Hao Lin, Hsun-Ying Huang +1 more | 2021-11-23 |
| 11152417 | Anchor structures and methods for uniform wafer planarization and bonding | Chia-Yu Wei, Cheng-Yuan Li, Hsin-Chi Chen, Kuo-Cheng Lee, Hsun-Ying Huang | 2021-10-19 |
| 11133269 | Semiconductor package and manufacturing method thereof | Chun-Ti Lu, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tzu-Sung Huang | 2021-09-28 |
| 11018179 | Semiconductor structure | Chia-Yu Wei, Chin-Hsun Hsiao, Yi-Hsing Chu, Yung-Lung Hsu, Hsin-Chi Chen | 2021-05-25 |
| 11004811 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Chen-Hua Yu +2 more | 2021-05-11 |