Issued Patents All Time
Showing 101–106 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9105530 | Conductive contacts having varying widths and method of manufacturing same | Yu-Jen Tseng, Chang-Chia Huang, Tin-Hao Kuo, Chen-Shien Chen | 2015-08-11 |
| 9105533 | Bump structure having a single side recess | Chih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen | 2015-08-11 |
| 8981576 | Structure and method for bump to landing trace ratio | Chen-Hua Yu, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Sheng-Yu Wu | 2015-03-17 |
| 8922006 | Elongated bumps in integrated circuit devices | Chen-Shien Chen, Tin-Hao Kuo, Sheng-Yu Wu, Tsung-Shu Lin, Chang-Chia Huang | 2014-12-30 |
| 8853853 | Bump structures | Chih-Horng Chang, Tin-Hao Kuo, Chen-Shien Chen | 2014-10-07 |
| 8643196 | Structure and method for bump to landing trace ratio | Chen-Hua Yu, Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Sheng-Yu Wu | 2014-02-04 |