Issued Patents All Time
Showing 51–75 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666692 | Method of forming FinFET gate oxide | Cheng-Ta Wu, Yuan Chen | 2017-05-30 |
| 9589804 | Method of forming finFET gate oxide | Cheng-Ta Wu, Shiu-Ko JangJian, Chung-Ren Sun, Ming-Te Chen, Jun Cheng | 2017-03-07 |
| 9577102 | Method of forming gate and finFET | Yu-Ting Hsiao, Cheng-Ta Wu, Lun-Kuang Tan, Liang-Yu Yen, Tsung-Han Wu +1 more | 2017-02-21 |
| 9543234 | In-situ formation of silicon and tantalum containing barrier | Shiu-Ko JangJian, Szu-An Wu | 2017-01-10 |
| 9508548 | Method for forming barrier layer for dielectric layers in semiconductor devices | Sheng-Wen Chen, Yu-Ting Lin, Che-Hao Chang, Wei-Ming You | 2016-11-29 |
| 9478660 | Protection layer on fin of fin field effect transistor (FinFET) device structure | Shiu-Ko JangJian, Chi-Cherng Jeng, Chih-Nan Wu, Chun Che Lin | 2016-10-25 |
| 9478581 | Grids in backside illumination image sensor chips and methods for forming the same | Shiu-Ko JangJian, Min Hao Hong, Chung-Ren Sun | 2016-10-25 |
| 9406675 | FinFET structure and method of manufacturing the same | Cheng-Ta Wu, Cheng-Wei Chen, Hong-Yi Wu, Shiu-Ko JangJian, Wei-Ming You | 2016-08-02 |
| 9337192 | Metal gate stack having TaAlCN layer | Shiu-Ko JangJian, Chi-Cherng Jeng, Chi-Wen Liu | 2016-05-10 |
| 9337303 | Metal gate stack having TiAICN as work function layer and/or blocking/wetting layer | Shiu-Ko JangJian, Chi-Wen Liu, Chi-Cherng Jeng | 2016-05-10 |
| 9257476 | Grids in backside illumination image sensor chips and methods for forming the same | Shiu-Ko JangJian, Min Hao Hong, Chung-Ren Sun | 2016-02-09 |
| 9064823 | Method for qualifying a semiconductor wafer for subsequent processing | I-Che Huang, Pu Chen | 2015-06-23 |
| 9041140 | Grids in backside illumination image sensor chips and methods for forming the same | Shiu-Ko JangJian, Min Hao Hong, Chung-Ren Sun | 2015-05-26 |
| 8946083 | In-situ formation of silicon and tantalum containing barrier | Shiu-Ko JangJian, Szu-An Wu | 2015-02-03 |
| 8748885 | Soft material wafer bonding and method of bonding | Tung-Ti Yeh, Chung-Yi Huang, Ya-Wen Wu, Hui Mei Jao, Shiu-Ko JangJian +1 more | 2014-06-10 |
| 8592297 | Wafer and method of processing wafer | Tung-Ti Yeh, Wu-Chang Lin, Chung-Yi Huang, Ya-Wen Wu, Hui Mei Jao +1 more | 2013-11-26 |
| 7304728 | Test device and method for laser alignment calibration | Shih-Tzung Chang, Yu-Ku Lin, Shih-Ho Lin, Kei-Wei Chen, Ching-Hwan Su +1 more | 2007-12-04 |
| 6985222 | Chamber leakage detection by measurement of reflectivity of oxidized thin film | Hsi-Kuei Cheng, Chu-Chang Chen, Szu-An Wu, Ying-Lang Wang, Hsien-Ping Feng | 2006-01-10 |
| 6863491 | Catch-pin water support for process chamber | Hsi-Kuei Cheng, Chun-Tse Lin, Yu-Ku Lin, Ying-Lang Wang | 2005-03-08 |
| 6828226 | Removal of SiON residue after CMP | Kei-Wei Chen, Kuo-Hsiu Wei, Yu-Kin Lin, Ying-Lang Wang, Shih-Tzung Chang | 2004-12-07 |
| 6769959 | Method and system for slurry usage reduction in chemical mechanical polishing | Kei-Wei Chen, Shih-Tzung Chang, Yu-Ku Lin, Ying-Lang Wang, Ming-Wen Chen +1 more | 2004-08-03 |
| 6682605 | Apparatus and method for removing coating layers from alignment marks | Aaron Cheng, Yu-Ku Lin, Chun-Chang Chen, Yi Wang | 2004-01-27 |
| 6645825 | Planarization of shallow trench isolation (STI) | Chin Kun Lan, Tong-Hua Kuan, Ying-Lang Wang | 2003-11-11 |
| 6626741 | Method for improving thickness uniformity on a semiconductor wafer during chemical mechanical polishing | Kei-Wei Chen, Shih-Tzung Chang, Yu-Ku Lin, Ying-Lang Wang | 2003-09-30 |
| 6146991 | Barrier metal composite layer featuring a thin plasma vapor deposited titanium nitride capping layer | Kuo-Hsien Cheng | 2000-11-14 |