Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9368387 | Method of forming shallow trench isolation structure | Tai-Yung Yu, Jin-Lin Liang, Chien-Hua Li, Cheng Tao, Shian Wei Mao +1 more | 2016-06-14 |
| 8748885 | Soft material wafer bonding and method of bonding | Tung-Ti Yeh, Chung-Yi Huang, Ya-Wen Wu, Ting-Chun Wang, Shiu-Ko JangJian +1 more | 2014-06-10 |
| 8592297 | Wafer and method of processing wafer | Tung-Ti Yeh, Wu-Chang Lin, Chung-Yi Huang, Ya-Wen Wu, Ting-Chun Wang +1 more | 2013-11-26 |