Issued Patents All Time
Showing 101–123 of 123 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637087 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2023-04-25 |
| 11610835 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2023-03-21 |
| 11594477 | Semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2023-02-28 |
| 11574861 | Semiconductor package | Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2023-02-07 |
| 11532593 | Embedded stress absorber in package | Shin-Puu Jeng, Chien-Sheng Chen, Po-Yao Lin, Po-Chen Lai | 2022-12-20 |
| 11532535 | Semiconductor die package with thermal management features and method for forming the same | Yu-Sheng Lin, Po-Yao Lin, Chin-Hua Wang, Shin-Puu Jeng | 2022-12-20 |
| 11527457 | Package structure with buffer layer embedded in lid layer | Yu-Sheng Lin, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2022-12-13 |
| 11508710 | Method of forming semiconductor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng +1 more | 2022-11-22 |
| 11450622 | Semiconductor package | Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2022-09-20 |
| 11410939 | Chip package with lid | Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2022-08-09 |
| 11328971 | Semiconductor device and method of manufacture | Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2022-05-10 |
| 11264359 | Chip bonded to a redistribution structure with curved conductive lines | Chia-Kuei Hsu, Ming-Chih Yew, Che-Chia Yang, Po-Yao Lin, Shin-Puu Jeng | 2022-03-01 |
| 11011447 | Semiconductor package and method for forming the same | Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin | 2021-05-18 |
| 10797006 | Structure and formation method of chip package with lid | Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2020-10-06 |
| 10727147 | Semiconductor device and method of manufacture | Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2020-07-28 |
| 10714463 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng +1 more | 2020-07-14 |
| 10504880 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng +1 more | 2019-12-10 |
| 10276551 | Semiconductor device package and method of forming semiconductor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng +1 more | 2019-04-30 |
| 10163816 | Structure and formation method of chip package with lid | Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2018-12-25 |
| 10109547 | Semiconductor device and method of manufacture | Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng, Chih-Kung Huang, Tsung-Ming Yeh | 2018-10-23 |
| 9870975 | Chip package with thermal dissipation structure and method for forming the same | Chin-Hua Wang, Po-Yao Lin, Kuang-Chun Lee, Shin-Puu Jeng, Shyue-Ter Leu +2 more | 2018-01-16 |
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Cheng-Lin Huang, Chin-Hua Wang, Kuang-Chun Lee, Wen-Yi Lin, Ming-Chih Yew +4 more | 2017-08-29 |
| 9721868 | Three dimensional integrated circuit (3DIC) having a thermally enhanced heat spreader embedded in a substrate | Po-Yao Lin, Wen-Yi Lin, Shyue-Ter Leu, Ming-Chih Yew | 2017-08-01 |