Issued Patents All Time
Showing 51–75 of 123 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040267 | Organic interposer including intra-die structural reinforcement structures and methods of forming the same | Li-Ling Liao, Ming-Chih Yew, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-07-16 |
| 12033871 | Method for forming semiconductor die package with ring structure comprising recessed parts | Yu-Sheng Lin, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033906 | Semiconductor package and manufacturing method thereof | Che-Chia Yang, Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033913 | Chip package structure with lid and method for forming the same | Che-Chia Yang, Yu-Sheng Lin, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033928 | Manufacturing method of semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12033947 | Semiconductor package structure and method for forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-07-09 |
| 12021042 | Semiconductor package and method of manufacturing the same | Kai-Ming Ching, Chien-Hung Chen, Hui Yu, Yu-Min Cheng | 2024-06-25 |
| 12009276 | Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same | Yu-Sheng Lin, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-06-11 |
| 12009278 | Package structure with buffer layer embedded in lid layer | Yu-Sheng Lin, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-06-11 |
| 11996346 | Semiconductor device and manufacturing method thereof | Po-Yao Lin, Hui Yu, Shyue-Ter Leu, Shin-Puu Jeng | 2024-05-28 |
| 11997842 | Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same | Ming-Chih Yew, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2024-05-28 |
| 11984378 | Semiconductor package structure and method for forming the same | Po-Yao Lin, Chin-Hua Wang, Yu-Sheng Lin, Shin-Puu Jeng | 2024-05-14 |
| 11978722 | Structure and formation method of package containing chip structure with inclined sidewalls | Po-Chen Lai, Che-Chia Yang, Li-Ling Liao, Po-Yao Lin, Shin-Puu Jeng | 2024-05-07 |
| 11973001 | Semiconductor device and method of manufacture | Chin-Hua Wang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-04-30 |
| 11967547 | Solder resist structure to mitigate solder bridge risk | Chin-Hua Wang, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-04-23 |
| 11967582 | Multi-chip device and method of formation | Chin-Hua Wang, Po-Chen Lai, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2024-04-23 |
| 11955455 | Embedded stress absorber in package | Shin-Puu Jeng, Chien-Sheng Chen, Po-Yao Lin, Po-Chen Lai | 2024-04-09 |
| 11915991 | Semiconductor device having first heat spreader and second heat spreader and manufacturing method thereof | Po-Yao Lin, Yu-Sheng Lin, Po-Chen Lai, Shin-Puu Jeng | 2024-02-27 |
| 11908757 | Die corner removal for molding compound crack suppression in semiconductor die packaging and methods for forming the same | Chia-Kuei Hsu, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2024-02-20 |
| 11894320 | Semiconductor device package with stress reduction design and method of forming the same | Chin-Hua Wang, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-02-06 |
| 11862580 | Semiconductor package | Chin-Hua Wang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-01-02 |
| 11862528 | Method for forming semiconductor package | Chin-Hua Wang, Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin | 2024-01-02 |
| 11854929 | Semiconductor package and method of forming the same | Yu-Sheng Lin, Chin-Hua Wang, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11855009 | Chip package with lid | Chin-Hua Wang, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2023-12-26 |
| 11855008 | Stacking via structures for stress reduction | Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng, Chia-Hsiang Lin | 2023-12-26 |