Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621205 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin +1 more | 2023-04-04 |
| 11587886 | Semiconductor device | Sung-Hui Huang, Pai Yuan Li, Shu-Chia Hsu, Hsiang-Fan Lee, Szu-Po Huang | 2023-02-21 |
| 11569156 | Semiconductor device, electronic device including the same, and manufacturing method thereof | Sung-Hui Huang, Shang-Yun Hou | 2023-01-31 |
| 11502056 | Joint structure in semiconductor package and manufacturing method thereof | Chih-Wei Wu, Sung-Hui Huang, Shang-Yun Hou, Ying-Ching Shih, Cheng-Chieh Li | 2022-11-15 |
| 11502015 | Semiconductor package and manufacturing method thereof | Wen-Wei Shen, Sung-Hui Huang, Shang-Yun Hou | 2022-11-15 |
| 11454773 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2022-09-27 |
| 11450580 | Semiconductor structure and method of fabricating the same | Sung-Hui Huang, Shang-Yun Hou, Chien-Yuan Huang | 2022-09-20 |
| 11437334 | Chip package structure | Sung-Hui Huang, Shang-Yun Hou | 2022-09-06 |
| 11328936 | Structure and formation method of package structure with underfill | Sung-Hui Huang, Jui Hsieh Lai, Shang-Yun Hou | 2022-05-10 |
| 11270956 | Package structure and fabricating method thereof | Sung-Hui Huang, Shang-Yun Hou | 2022-03-08 |
| 11222867 | Package and manufacturing method thereof | Sung-Hui Huang, Shang-Yun Hou | 2022-01-11 |
| 11201097 | Method of manufacture of a semiconductor device | Chih-Wei Wu, Li-Chung Kuo, Long Hua Lee, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-12-14 |
| 11121050 | Method of manufacture of a semiconductor device | Chih-Wei Wu, Li-Chung Kuo, Long Hua Lee, Sung-Hui Huang, Ying-Ching Shih +1 more | 2021-09-14 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang +8 more | 2021-08-24 |
| 11101236 | Semiconductor package and method of forming the same | Li-Chung Kuo, Sung-Hui Huang, Shang-Yun Hou, Tsung-Yu Chen, Chien-Yuan Huang | 2021-08-24 |
| 11075133 | Underfill structure for semiconductor packages and methods of forming the same | Yu-Wei Chen, Li-Chung Kuo, Ying-Ching Shih, Szu-Wei Lu, Jing-Cheng Lin +1 more | 2021-07-27 |
| 11024616 | Package structure and method of manufacturing the same | Yu-Wei Chen, Li-Chung Kuo, Long Hua Lee, Szu-Wei Lu, Ying-Ching Shih | 2021-06-01 |
| 10985125 | Chip package structure | Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu, Shang-Yun Hou +4 more | 2021-04-20 |
| 10886147 | Package structure and method for forming the same | Sung-Hui Huang, Shang-Yun Hou | 2021-01-05 |
| 10872871 | Chip package structure with dummy bump and method for forming the same | Sung-Hui Huang, Shang-Yun Hou, Yushun Lin, Heh-Chang Huang, Shu-Chia Hsu +2 more | 2020-12-22 |
| 10866373 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2020-12-15 |
| 10867951 | Semiconductor device | Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Pai Yuan Li, Sung-Hui Huang +2 more | 2020-12-15 |
| 10847485 | Chip package structure and method for forming the same | Sung-Hui Huang, Shang-Yun Hou | 2020-11-24 |
| 10790254 | Chip package structure | Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu, Shang-Yun Hou +4 more | 2020-09-29 |
| 10770405 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Da-Cyuan Yu, Pai Yuan Li, Hsiang-Fan Lee | 2020-09-08 |