Issued Patents All Time
Showing 51–75 of 195 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11685013 | Polishing pad for chemical mechanical planarization | Chih-Hung Chen, Ying-Lang Wang | 2023-06-27 |
| 11679469 | Chemical mechanical planarization tool | Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang +7 more | 2023-06-20 |
| 11675953 | Hotspot avoidance method of manufacturing integrated circuits | I-Shuo Liu, Chih-Chun Hsia, Hsin-Ting Chou, Kuanhua Su, William Weilun Hong +1 more | 2023-06-13 |
| 11670690 | Semiconductor device with dielectric spacer liner on source/drain contact | Chi-Cheng Hung, Yu-Sheng Wang, Ming-Ching CHUNG, Chia-Yang Wu | 2023-06-06 |
| 11664213 | Bevel edge removal methods, tools, and systems | Hui-Chi Huang, Jeng-Chi Lin, Pin-Chuan Su, Chien-Ming Wang | 2023-05-30 |
| 11658065 | Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2023-05-23 |
| 11637021 | Metal heterojunction structure with capping metal layer | Yi-Sheng Lin, Chi-Jen Liu, Chi-Hsiang Shen, Te-Ming Kung, Chun-Wei Hsu +4 more | 2023-04-25 |
| 11633829 | External heating system for use in chemical mechanical polishing system | Yi-Sheng Lin, Chi-Hsiang Shen, Chi-Jen Liu, Chun-Wei Hsu, Yang-Chun Cheng | 2023-04-25 |
| 11631618 | Thickness sensor for conductive features | Chih-Hung Chen, Ying-Lang Wang | 2023-04-18 |
| 11621342 | Semiconductor device, method, and tool of manufacture | Chih-Hung Chen, Ying-Lang Wang | 2023-04-04 |
| 11590627 | Mega-sonic vibration assisted chemical mechanical planarization | Chun-Hao Kung, Shang-Yu Wang, Ching-Hsiang Tsai, Hui-Chi Huang | 2023-02-28 |
| 11594680 | Method of forming a FinFET device | Chang-Miao Liu, Bwo-Ning Chen | 2023-02-28 |
| 11569387 | Semiconductor device including fin structures and manufacturing method thereof | Chun Hsiung Tsai | 2023-01-31 |
| 11551936 | Self-healing polishing pad | Chun-Hao Kung, Hui-Chi Huang, Yen-Ting Chen | 2023-01-10 |
| 11532514 | Structure and formation method of semiconductor device with conductive feature | Li-Chieh Wu, Kuo-Hsiu Wei, Tang-Kuei Chang, Chia Hsuan Lee, Jian-Ci Lin | 2022-12-20 |
| 11508585 | Methods for chemical mechanical polishing and forming interconnect structure | Ji Cui, Fu-Ming Huang, Ting-Kui Chang, Tang-Kuei Chang, Chun-Chieh Lin +7 more | 2022-11-22 |
| 11482450 | Methods of forming an abrasive slurry and methods for chemical- mechanical polishing | Chia Hsuan Lee, Chun-Wei Hsu, Chia-Wei Ho, Chi-Hsiang Shen, Li-Chieh Wu +6 more | 2022-10-25 |
| 11450742 | FinFET structure and method for manufacturing thereof | Chun Hsiung Tsai, Lai-Wan Chong, Chien-Wei Lee | 2022-09-20 |
| 11450565 | Ion implant process for defect elimination in metal layer planarization | Chia-Cheng Chen, Huicheng Chang, Fu-Ming Huang, Liang-Yin Chen, Tang-Kuei Chang +3 more | 2022-09-20 |
| 11446785 | Methods to clean chemical mechanical polishing systems | Chih-Chieh Chang, Yen-Ting Chen, Hui-Chi Huang | 2022-09-20 |
| 11443095 | Hotspot avoidance method for manufacturing integrated circuits | I-Shuo Liu, Chih-Chun Hsia, Hsin-Ting Chou, Kuanhua Su, William Weilun Hong +1 more | 2022-09-13 |
| 11437497 | Semiconductor device and method | Ji-Yin Tsai, Jung-Jen Chen, Pei-Ren Jeng, Chii-Horng Li, Yee-Chia Yeo | 2022-09-06 |
| 11417566 | Semiconductor device structure with interconnect structure and method for forming the same | Chun-Hao Kung, Chih-Chieh Chang, Kao-Feng Liao, Hui-Chi Huang | 2022-08-16 |
| 11397078 | Thin film metrology | Chih-Hung Chen, Te-Ming Kung | 2022-07-26 |
| 11373879 | Chemical mechanical polishing method | Tung-Kai Chen, Ching-Hsiang Tsai, Kao-Feng Liao, Chih-Chieh Chang, Chun-Hao Kung +4 more | 2022-06-28 |