Issued Patents All Time
Showing 26–50 of 367 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057412 | Device crack-stop structure to prevent damage due to dicing crack | Tung-Ting Wu, Chen-Jong Wang, Yimin Huang, Chin-Chia Kuo | 2024-08-06 |
| 12040336 | Semiconductor imaging device having improved dark current performance | Seiji Takahashi, Chen-Jong Wang, Dun-Nian Yaung, Feng-Chi Hung, Feng-Jia Shiu +5 more | 2024-07-16 |
| 12034037 | Backside capacitor techniques | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin | 2024-07-09 |
| 12033919 | Backside or frontside through substrate via (TSV) landing on metal | Zheng-Xun Li, Min-Feng Kao, Hsing-Chih Lin, Dun-Nian Yaung | 2024-07-09 |
| 12015099 | Semiconductor sensor and methods thereof | Yin-Kai Liao, Kuan-Chieh Huang, Chih-Ming Hung, Yi-Shin Chu, Hsiang-Lin Chen +1 more | 2024-06-18 |
| 12009214 | Gate electrodes with notches and methods for forming the same | Min-Feng Kao, Szu-Ying Chen, Dun-Nian Yaung, Tzu-Hsuan Hsu, Feng-Chi Hung | 2024-06-11 |
| 11984465 | Multiple deep trench isolation (MDTI) structure for CMOS image sensor | Wei Chuang Wu, Ching-Chun Wang, Dun-Nian Yaung, Feng-Chi Hung, Yen-Ting Chiang +2 more | 2024-05-14 |
| 11978758 | Methods and apparatus for via last through-vias | Szu-Ying Chen, Pao-Tung Chen, Dun-Nian Yaung | 2024-05-07 |
| 11973101 | Mechanisms for forming image-sensor device with deep-trench isolation structure | Jeng-Shyan Lin, Dun-Nian Yaung, Feng-Chi Hung | 2024-04-30 |
| 11955428 | Semiconductor structure and manufacturing method thereof | Hsin-Hung Chen, Min-Feng Kao, Hsing-Chih Lin, Dun-Nian Yaung | 2024-04-09 |
| 11948949 | Vertical gate field effect transistor | Chun-Yuan Chen, Ching-Chun Wang, Hsiao-Hui Tseng, Jhy-Jyi Sze, Shyh-Fann Ting +4 more | 2024-04-02 |
| 11942368 | Through silicon vias and methods of fabricating thereof | Min-Feng Kao, Hsing-Chih Lin, Dun-Nian Yaung | 2024-03-26 |
| 11923392 | Enhanced design for image sensing technology | Keng-Yu Chou, Chun-Hao Chuang, Kazuaki Hashimoto, Ming-En Chen, Shyh-Fann Ting +2 more | 2024-03-05 |
| 11915977 | Interconnect structure for stacked device | Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Feng-Chi Hung, Chih-Hui Huang +3 more | 2024-02-27 |
| 11908900 | Passivation layer for epitaxial semiconductor process | Yin-Kai Liao, Sin-Yi Jiang, Hsiang-Lin Chen, Yi-Shin Chu, Po-Chun Liu +2 more | 2024-02-20 |
| 11908878 | Image sensor and manufacturing method thereof | Min-Feng Kao, Dun-Nian Yaung, Wen-Chang Kuo, Sheng-Chau Chen, Feng-Chi Hung +1 more | 2024-02-20 |
| 11901396 | Back side illuminated image sensor with reduced sidewall-induced leakage | Shuang-Ji Tsai, Dun-Nian Yaung, Wen-De Wang, Hsiao-Hui Tseng | 2024-02-13 |
| 11901387 | Image sensor | Min-Feng Kao, Dun-Nian Yaung, Wen-Chang Kuo, Sheng-Chau Chen, Feng-Chi Hung +1 more | 2024-02-13 |
| 11862535 | Through-substrate-via with reentrant profile | Hung-Ling Shih, Wei Chuang Wu, Shih Kuang Yang, Hsing-Chih Lin | 2024-01-02 |
| 11854959 | Metal-insulator-metal device with improved performance | Min-Feng Kao, Dun-Nian Yaung, Hsing-Chih Lin, Kuan-Hua Lin | 2023-12-26 |
| 11837595 | Semiconductor device structure and method for manufacturing the same | Cheng-Ying Ho, Wen-De Wang, Dun-Nian Yaung | 2023-12-05 |
| 11817470 | Stacked substrate structure with inter-tier interconnection | Jeng-Shyan Lin, Dun-Nian Yaung, Hsun-Ying Huang, Wei-Chih Weng, Yu-Yang Shen | 2023-11-14 |
| 11798916 | 3DIC interconnect apparatus and method | Shu-Ting Tsai, Dun-Nian Yaung, Chun-Chieh Chuang, Chia-Chieh Lin, U-Ting Chen | 2023-10-24 |
| 11791361 | Image sensor with overlap of backside trench isolation structure and vertical transfer gate | Feng-Chi Hung, Dun-Nian Yaung, Wei Chuang Wu, Yen-Yu Chen, Chih-Kuan Yu | 2023-10-17 |
| 11791357 | Composite BSI structure and method of manufacturing the same | Wei Chuang Wu, Dun-Nian Yaung, Feng-Chi Hung, Jhy-Jyi Sze, Keng-Yu Chou +3 more | 2023-10-17 |