Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009301 | Interconnect structure | Shao-Kuan Lee, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-06-11 |
| 12002749 | Barrier and air-gap scheme for high performance interconnects | Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue +1 more | 2024-06-04 |
| 12002750 | Interconnect structure | Shao-Kuan Lee, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-06-04 |
| 11990400 | Capping layer overlying dielectric structure to increase reliability | Ting-Ya Lo, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2024-05-21 |
| 11948834 | Selective deposition of barrier layer | Hai-Ching Chen, Shau-Lin Shue | 2024-04-02 |
| 11935783 | Selective deposition for integrated circuit interconnect structures | Shao-Kuan Lee, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-03-19 |
| 11923243 | Semiconductor structure having air gaps and method for manufacturing the same | Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue +1 more | 2024-03-05 |
| 11908792 | Semiconductor device comprising cap layer over dielectric layer and method of manufacture | Shao-Kuan Lee, Hai-Ching Chen, Shau-Lin Shue, Cheng-Chin Lee | 2024-02-20 |
| 11908794 | Protection liner on interconnect wire to enlarge processing window for overlying interconnect via | Shin-Yi Yang, Ming-Han Lee, Shau-Lin Shue, Yu-Chen Chan, Meng-Pei Lu | 2024-02-20 |
| 11901221 | Interconnect strucutre with protective etch-stop | Shao-Kuan Lee, Hai-Ching Chen, Shau-Lin Shue, Cheng-Chin Lee | 2024-02-13 |
| 11894266 | Metal capping layer and methods thereof | Shao-Kuan Lee, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-02-06 |
| 11854963 | Semiconductor interconnection structure and methods of forming the same | Shao-Kuan Lee, Kuang-Wei YANG, Cherng-Shiaw Tsai, Cheng-Chin Lee, Ting-Ya Lo +3 more | 2023-12-26 |
| 11842966 | Integrated chip with inter-wire cavities | Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao +2 more | 2023-12-12 |
| 11830808 | Semiconductor structure and method making the same | Kai-Fang Cheng, Chi-Lin Teng, Hai-Ching Chen, Tien-I Bao | 2023-11-28 |
| 11810815 | Dielectric capping structure overlying a conductive structure to increase stability | Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee, Cheng-Chin Lee +1 more | 2023-11-07 |
| 11769695 | Semiconductor structure including low-resistance interconnect and integrated circuit device having the same | Shao-Kuan Lee, Cheng-Chin Lee, Hsiang-Wei Liu, Tai-I Yang, Chia-Tien Wu +2 more | 2023-09-26 |
| 11756878 | Self-aligned via structure by selective deposition | Shao-Kuan Lee, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2023-09-12 |
| 11658092 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2023-05-23 |
| 11640928 | Heat dispersion layers for double sided interconnect | Shao-Kuan Lee, Shau-Lin Shue, Hsiao-Kang Chang, Cherng-Shiaw Tsai | 2023-05-02 |
| 11557511 | Semiconductor device structure and methods of forming the same | Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Hsiaokang CHANG +1 more | 2023-01-17 |
| 11538749 | Interconnect structure | Shao-Kuan Lee, Cheng-Chin Lee, Kuang-Wei YANG, Ting-Ya Lo, Chi-Lin Teng +2 more | 2022-12-27 |
| 11527435 | Metal capping layer and methods thereof | Shao-Kuan Lee, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2022-12-13 |
| 11450566 | Semiconductor device and manufacturing method thereof | Kai-Fang Cheng, Chi-Lin Teng, Shao-Kuan Lee, Hai-Ching Chen | 2022-09-20 |
| 11361989 | Method for manufacturing interconnect structures including air gaps | Cheng-Chin Lee, Shao-Kuan Lee, Hai-Ching Chen, Shau-Lin Shue | 2022-06-14 |
| 11355390 | Interconnect strucutre with protective etch-stop | Shao-Kuan Lee, Hai-Ching Chen, Shau-Lin Shue, Cheng-Chin Lee | 2022-06-07 |