FY

Fu-Liang Yang

TSMC: 123 patents #180 of 12,232Top 2%
VS Vanguard International Semiconductor: 29 patents #10 of 585Top 2%
NL National Applied Research Laboratories: 3 patents #58 of 506Top 15%
AS Academia Sinica: 1 patents #407 of 1,112Top 40%
HT Huazhong University Of Science And Technology: 1 patents #389 of 1,292Top 35%
Overall (All Time): #5,475 of 4,157,543Top 1%
159
Patents All Time

Issued Patents All Time

Showing 126–150 of 159 patents

Patent #TitleCo-InventorsDate
6686255 Amorphizing ion implant local oxidation of silicon (LOCOS) method for forming an isolation region Chi-Ming Yang 2004-02-03
6674130 High performance PD SOI tunneling-biased MOSFET Kuo-Nan Yang, Yi-Ling Chan, You-Lin Chu, Hou-Yu Chen, Chenming Hu 2004-01-06
6518105 High performance PD SOI tunneling-biased MOSFET Kuo-Nan Yang, Yi-Ling Chan, You-Lin Chu, Hou-Yu Chen, Chenming Hu 2003-02-11
6492216 Method of forming a transistor with a strained channel Yee-Chia Yeo, Chenming Hu 2002-12-10
6277709 Method of forming shallow trench isolation structure Yin-Pin Wang, Chung-Ju Lee, Wen-Jya Liang, Jhy-Weei Hsia, Yuh-Sheng Chern 2001-08-21
6278189 High density integrated circuits using tapered and self-aligned contacts Erik S. Jeng, Tzu-Shih Yen 2001-08-21
6261923 Method to solve the dishing issue in CMP planarization by using a nitride hard mask for local inverse etchback and CMP Ming-Hong Kuo, Wei-Ray Lin 2001-07-17
6248643 Method of fabricating a self-aligned contact Chien-Sheng Hsieh, Wei-Ray Lin, Erik S. Jeng, Bor-Ru Sheu 2001-06-19
6239034 Method of manufacturing inter-metal dielectric layers for semiconductor devices Liang-Tung Chang 2001-05-29
6180489 Formation of finely controlled shallow trench isolation for ULSI process Bih-Tiao Lin, Wei-Ray Lin, Erik S. Jeng 2001-01-30
6174815 Method for planarizing DRAM cells Chau-Jen Kuo, Bin Liu 2001-01-16
6171929 Shallow trench isolator via non-critical chemical mechanical polishing Chung-Ju Lee, Meow-Ru Hsu, Ming-Hong Kuo, Ing-Ruey Liaw 2001-01-09
6159822 Self-planarized shallow trench isolation Chung-Ju Lee, Meow-Ru Sheu 2000-12-12
6159821 Methods for shallow trench isolation Hsu-Li Cheng, Wei-Ray Lin 2000-12-12
6140240 Method for eliminating CMP induced microscratches Bih-Tiao Lin, Tzu-Shih Yen, Bi-Ling Chen, Erik S. Jeng 2000-10-31
6130127 Method for making dynamic random access memory cells having cactus-shaped stacked capacitors with increased capacitance 2000-10-10
6071789 Method for simultaneously fabricating a DRAM capacitor and metal interconnections Erik S. Jeng, Bih-Tiao Lin, I-Ping Lee 2000-06-06
6060348 Method to fabricate isolation by combining locos and shallow trench isolation for ULSI technology Wei-Ray Lin, Ming-Hong Kuo, Erik S. Jeng 2000-05-09
6057210 Method of making a shallow trench isolation for ULSI formation via in-direct CMP process Wei-Ray Lin, Ming-Hong Kuo 2000-05-02
6054017 Chemical mechanical polishing pad with controlled polish rate Bih-Tiao Lin 2000-04-25
6037259 Method for forming identifying characters on a silicon wafer Bih-Tiao Lin 2000-03-14
6037216 Method for simultaneously fabricating capacitor structures, for giga-bit DRAM cells, and peripheral interconnect structures, using a dual damascene process Hao Liu, Wan-Yih Lien, Tzu-Shih Yen 2000-03-14
5994228 Method of fabricating contact holes in high density integrated circuits using taper contact and self-aligned etching processes Erik S. Jeng, Tzu-Shih Yen 1999-11-30
5956594 Method for simultaneously forming capacitor plate and metal contact structures for a high density DRAM device Bi-Ling Chen, Erik S. Jeng 1999-09-21
5920791 Method of manufacturing intermetal dielectrics for sub-half-micron semiconductor devices Tony Chang 1999-07-06