Issued Patents All Time
Showing 51–75 of 107 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211360 | Passive device module, semiconductor package including the same, and manufacturing method thereof | Shih-Ya Huang, Chen-Hua Yu, Chuei-Tang Wang | 2021-12-28 |
| 11195817 | Semiconductor package and manufacturing method thereof | Shih-Ya Huang, Chen-Hua Yu, Chuei-Tang Wang, Chih-Yuan Chang | 2021-12-07 |
| 11171088 | Electronic apparatus including antennas and directors | Tzu-Chun Tang, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu | 2021-11-09 |
| 11125241 | Ceiling fan | Alex Horng, Tso-Kuo Yin | 2021-09-21 |
| 11094671 | Package with thinned substrate | Chen-Hua Yu, Chuei-Tang Wang | 2021-08-17 |
| 11062998 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Chuei-Tang Wang, Wei-Ting Chen, Chien-Hsun Chen, Shih-Ya Huang | 2021-07-13 |
| 11050153 | Encapsulating low-k dielectric blocks along with dies in an encapsulant to form antennas | Monsen Liu, Lai Wei Chih, Jeng-Shien Hsieh, En-Hsiang Yeh, Chuei-Tang Wang | 2021-06-29 |
| 11018113 | Memory module, semiconductor package including the same, and manufacturing method thereof | Lipu Kris Chuang, Hsin-Yu Pan, Yi-Che Chiang, Chien-Chang Lin | 2021-05-25 |
| 10978781 | 3D antenna for integrated circuits | Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu | 2021-04-13 |
| 10962711 | Semiconductor package and manufacturing method thereof | Chih-Chieh Chang, Chen-Hua Yu, Chuei-Tang Wang | 2021-03-30 |
| 10930628 | Photonic semiconductor device and method | Chih-Chieh Chang, Chuei-Tang Wang, Hsing-Kuo Hsia, Chen-Hua Yu | 2021-02-23 |
| 10879183 | Semiconductor device and method of manufacture | Chuei-Tang Wang, Chen-Hua Yu | 2020-12-29 |
| 10867938 | Package structure | Tzu-Chun Tang, Chen-Hua Yu, Chuei-Tang Wang | 2020-12-15 |
| 10818640 | Die stacks and methods forming same | Chen-Hua Yu, Chuei-Tang Wang | 2020-10-27 |
| 10811404 | Package structure and method of manufacturing the same | Shih-Ya Huang, Chen-Hua Yu, Chuei-Tang Wang | 2020-10-20 |
| 10796990 | Semiconductor structure, package structure, and manufacturing method thereof | Wei-Ting Chen, Chen-Hua Yu, Chuei-Tang Wang | 2020-10-06 |
| 10777502 | Semiconductor chip, package structure, and pacakge-on-package structure | Chuei-Tang Wang, Chen-Hua Yu, Wei-Ting Chen | 2020-09-15 |
| 10770313 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chun-Lin Lu, Yen-Ping Wang, Che-Wei Hsu | 2020-09-08 |
| 10770795 | Antenna device and method for manufacturing antenna device | Chuei-Tang Wang, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu | 2020-09-08 |
| 10763164 | Package structure with inductor and method of forming thereof | Chih-Lin Chen, Jeng-Shien Hsieh, Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang | 2020-09-01 |
| 10756052 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2020-08-25 |
| 10734323 | Package structures | Chun-Wen Lin, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu | 2020-08-04 |
| 10692817 | Semiconductor device with shielding structure for cross-talk reduction | Shih-Ya Huang, Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang | 2020-06-23 |
| 10679968 | Package with thinned substrate | Chen-Hua Yu, Chuei-Tang Wang | 2020-06-09 |
| 10607856 | Manufacturing method of redistribution layer | Kun-Yung Huang, Chih-Fu Lung, Shih-Chi Li, Mei-Chen Lee, Chi-Liang Wang | 2020-03-31 |