Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437336 | Semiconductor package structure with landing pads and manufacturing method thereof | Jeffrey Wang, Jen-I Huang | 2022-09-06 |
| 11289401 | Semiconductor package | — | 2022-03-29 |
| 10607856 | Manufacturing method of redistribution layer | Chih-Fu Lung, Shih-Chi Li, Mei-Chen Lee, Chung-Hao Tsai, Chi-Liang Wang | 2020-03-31 |
| 10460959 | Package structure and manufacturing method thereof | Yen-Ju Chen | 2019-10-29 |
| 10276545 | Semiconductor package and manufacturing method thereof | Chi-Liang Pan, Jing CHENG, Bin-Hui Tseng | 2019-04-30 |
| 10177058 | Encapsulating composition, semiconductor package and manufacturing method thereof | Ming-Yi Wang | 2019-01-08 |