Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276545 | Semiconductor package and manufacturing method thereof | Kun-Yung Huang, Jing CHENG, Bin-Hui Tseng | 2019-04-30 |
| 10177077 | Chip structure having redistribution layer | Ting-Feng Su | 2019-01-08 |
| 7894172 | ESD protection structure | Min-Lin Lee, Shinn-Juh Lai, Shih-Hsien Wu, Chen-Hsuan Chiu | 2011-02-22 |
| 7649723 | ESD protection substrate and integrated circuit utilizing the same | Chen-Hsuan Chiu, Min-Lin Lee, Shinn-Juh Lai, Shih-Hsien Wu | 2010-01-19 |