Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10249573 | Semiconductor device package with a stress relax pattern | Chia-Jen Chou | 2019-04-02 |
| 10177077 | Chip structure having redistribution layer | Chi-Liang Pan | 2019-01-08 |
| 9899287 | Fan-out wafer level package structure | Chia-Jen Chou | 2018-02-20 |
| 8063492 | Multi-chip stacked package | Chien-Ming Chen | 2011-11-22 |
| 7913539 | Apparatus for drop testing and method utilizing the same | — | 2011-03-29 |