Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488946 | Package method of a modular stacked semiconductor package | Yi-Hsin Chen, Guang-Ren Shen | 2022-11-01 |
| 10249573 | Semiconductor device package with a stress relax pattern | Ting-Feng Su | 2019-04-02 |
| 10126210 | Fault detection and classification matching | Yu-Jhen Liu, Yi-Ting Tsai, Jo-Ling Pan | 2018-11-13 |
| 9899287 | Fan-out wafer level package structure | Ting-Feng Su | 2018-02-20 |
| 9842811 | Heat-dissipating semiconductor package for lessening package warpage | — | 2017-12-12 |
| 9831219 | Manufacturing method of package structure | Yong-Cheng Chuang, Kuo-Ting Lin, Li-Chih Fang | 2017-11-28 |