Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437336 | Semiconductor package structure with landing pads and manufacturing method thereof | Jeffrey Wang, Kun-Yung Huang | 2022-09-06 |
| 9887148 | Fan-out semiconductor package structure and fabricating method | Ching-Yang Chen | 2018-02-06 |
| 8185223 | Multimedia playing method and apparatus using the same | Chyou-Hsiung Hwang | 2012-05-22 |