Issued Patents All Time
Showing 1,876–1,900 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6027861 | VLSIC patterning process | Syun-Ming Jang, Chao-Cheng Chen | 2000-02-22 |
| 6020263 | Method of recovering alignment marks after chemical mechanical polishing of tungsten | Tsu Shih | 2000-02-01 |
| 6020273 | Method of stabilizing low dielectric constant films | Yao-Yi Cheng, Syun-Min Jang | 2000-02-01 |
| 6020249 | Method for photo alignment after CMP planarization | Tsu Shih, Jui-Yu Chang, Syun-Ming Jang | 2000-02-01 |
| 6015749 | Method to improve adhesion between copper and titanium nitride, for copper interconnect structures, via the use of an ion implantation procedure | Chung-Shi Liu, Jane-Bai Lai, Lih-Juann Chen | 2000-01-18 |
| 6010948 | Shallow trench isolation process employing a BPSG trench fill | Syun-Ming Jang | 2000-01-04 |
| 6010962 | Copper chemical-mechanical-polishing (CMP) dishing | Chung-Shi Liu, Chung-Long Chang | 2000-01-04 |
| 6004883 | Dual damascene patterned conductor layer formation method without etch stop layer | Syun-Ming Jang | 1999-12-21 |
| 5972798 | Prevention of die loss to chemical mechanical polishing | Syun-Ming Jang, Jui-Yu Chang, Chung-Long Chang, Tsu Shih, Jeng-Horng Chen | 1999-10-26 |
| 5970378 | Multi-step plasma treatment process for forming low resistance titanium nitride layer | Shaulin Shue | 1999-10-19 |
| 5958800 | Method for post planarization metal photolithography | Syun-Ming Jang | 1999-09-28 |
| 5955787 | Method for forming intermetal dielectric with SOG etchback and CMP | Syun-Ming Jang | 1999-09-21 |
| 5942446 | Fluorocarbon polymer layer deposition predominant pre-etch plasma etch method for forming patterned silicon containing dielectric layer | Chao-Cheng Chen | 1999-08-24 |
| 5940726 | Method for forming an electrical contact for embedded memory | — | 1999-08-17 |
| 5922516 | Bi-layer silylation process | Chia-Shiung Tsai | 1999-07-13 |
| 5923996 | Method to protect alignment mark in CMP process | Tsu Shih, Jui-Yu Chang, Syun-Ming Jang | 1999-07-13 |
| 5911110 | Method of forming shallow trench isolation with dummy pattern in reverse tone mask | — | 1999-06-08 |
| 5904559 | Three dimensional contact or via structure with multiple sidewall contacts | — | 1999-05-18 |
| 5904563 | Method for metal alignment mark generation | — | 1999-05-18 |
| 5904573 | PE-TEOS process | Syun-Ming Jang, Lung Chen | 1999-05-18 |
| 5888309 | Lateral etch inhibited multiple for forming a via through a microelectronics layer susceptible to etching within a fluorine containing plasma followed by an oxygen containing plasma | — | 1999-03-30 |
| 5880022 | Self-aligned contact window | Kuo-Hua Lee | 1999-03-09 |
| 5871886 | Sandwiched middle antireflection coating (SMARC) process | Syun-Ming Jang | 1999-02-16 |
| 5871658 | Optical emisson spectroscopy (OES) method for monitoring and controlling plasma etch process when forming patterned layers | Hun-Jan Tao, Chia-Shiung Tsai | 1999-02-16 |
| 5869384 | Trench filling method employing silicon liner layer and gap filling silicon oxide trench fill layer | Syun-Ming Jang, Ying-Ho Chen | 1999-02-09 |