Issued Patents All Time
Showing 26–50 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8802507 | Fabrication method of semiconductor package device, and fabrication method of semiconductor package structure | Cheng-Chia Chiang, Chin-Huang Chang, Chien-Ping Huang, Jung-Pin Huang | 2014-08-12 |
| 8716070 | Fabrication method of package structure having MEMS element | Chi-Hsin Chiu, Chang-Yueh Chan, Hsin-Yi Liao, Chun-Chi Ke | 2014-05-06 |
| 8618641 | Leadframe-based semiconductor package | Chang-Yueh Chan, Chun-Yuan Li, Chih-Hsin Lai | 2013-12-31 |
| 8564115 | Package structure having micro-electromechanical element | Chang-Yueh Chan, Chien-Ping Huang, Chun-Chi Ke, Chun-An Huang | 2013-10-22 |
| 8546183 | Method for fabricating heat dissipating semiconductor package | Chien-Ping Huang | 2013-10-01 |
| 8420430 | Fabrication method of package structure having MEMS element | Chi-Hsin Chiu, Chang-Yueh Chan, Hsin-Yi Liao, Chun-Chi Ke | 2013-04-16 |
| 8367926 | Electronic apparatus and cover mechanism | Wen-Tang Peng | 2013-02-05 |
| 8304891 | Semiconductor package device, semiconductor package structure, and fabrication methods thereof | Cheng-Chia Chiang, Chin-Huang Chang, Chien-Ping Huang, Jung-Pin Huang | 2012-11-06 |
| 8241059 | Electrical connector and printed circuit board assembly | Wei Huang | 2012-08-14 |
| 8198689 | Package structure having micro-electromechanical element and fabrication method thereof | Chang-Yueh Chan, Chien-Ping Huang, Chun-Chi Ke, Chun-An Huang | 2012-06-12 |
| 8183092 | Method of fabricating stacked semiconductor structure | Chien-Ping Huang, Han-Ping Pu, Yu-Po Wang, Cheng-Hsu Hsiao | 2012-05-22 |
| 8013443 | Electronic carrier board and package structure thereof | Fang-Lin Tsai, Ho-Yi Tsai, Chien-Ping Huang | 2011-09-06 |
| 7939383 | Method for fabricating semiconductor package free of substrate | Chien-Ping Huang, Yu-Po Wang | 2011-05-10 |
| 7889511 | Electronic carrier board applicable to surface mount technology | Fang-Lin Tsai, Ho-Yi Tsai, Wen-Tsung Tseng | 2011-02-15 |
| 7816187 | Method for fabricating semiconductor package free of substrate | Chien-Ping Huang, Yu-Po Wang | 2010-10-19 |
| 7772685 | Stacked semiconductor structure and fabrication method thereof | Chien-Ping Huang, Han-Ping Pu, Yu-Po Wang, Cheng-Hsu Hsiao | 2010-08-10 |
| 7696623 | Electronic carrier board and package structure thereof | Fang-Lin Tsai, Ho-Yi Tsai, Chien-Ping Huang | 2010-04-13 |
| 7679178 | Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof | Han-Ping Pu, Chien-Ping Huang, Yu-Po Wang, Cheng-Hsu Hsiao | 2010-03-16 |
| 7667421 | Torque compensation method and system for DC brushless motor | — | 2010-02-23 |
| 7573722 | Electronic carrier board applicable to surface mounted technology (SMT) | Fang-Lin Tsai, Ho-Yi Tsai, Wen-Tsung Tseng | 2009-08-11 |
| 7508066 | Heat dissipating semiconductor package and fabrication method thereof | Chien-Ping Huang | 2009-03-24 |
| 7445957 | Method for fabricating wafer level semiconductor package with build-up layer | Chien-Ping Huang, Cheng-Hsu Hsiao | 2008-11-04 |
| 7446307 | Sensor semiconductor device and fabrication method of the sensor semiconductor device | Chien-Ping Huang, Cheng-Yi Chang | 2008-11-04 |
| 7423340 | Semiconductor package free of substrate and fabrication method thereof | Chien-Ping Huang, Yu-Po Wang | 2008-09-09 |
| 7365364 | Sensor semiconductor device with sensor chip | Chien-Ping Huang, Cheng-Yi Chang | 2008-04-29 |