Issued Patents All Time
Showing 51–75 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7354796 | Method for fabricating semiconductor package free of substrate | Chien-Ping Huang, Yu-Po Wang | 2008-04-08 |
| 7342318 | Semiconductor package free of substrate and fabrication method thereof | Chien-Ping Huang, Yu-Po Wang | 2008-03-11 |
| 7339280 | Semiconductor package with lead frame as chip carrier and method for fabricating the same | Jui-Yu Chuang, Lien-Chi Chan | 2008-03-04 |
| 7271024 | Method for fabricating sensor semiconductor device | Chien-Ping Huang, Cheng-Yi Chang | 2007-09-18 |
| 7271493 | Semiconductor package free of substrate and fabrication method thereof | Chien-Ping Huang, Yu-Po Wang | 2007-09-18 |
| 7205485 | Printed circuit board and method for fabricating the same | Chin-Tien Chiu, Chin-Huang Chang | 2007-04-17 |
| 7173828 | Ground pad structure for preventing solder extrusion and semiconductor package having the ground pad structure | Ying-Ren Lin, Ho-Yi Tsai | 2007-02-06 |
| 7170152 | Wafer level semiconductor package with build-up layer and method for fabricating the same | Chien-Ping Huang, Cheng-Hsu Hsiao | 2007-01-30 |
| 7160261 | Back sliding massager | — | 2007-01-09 |
| D529031 | IC card type circuit module | Chien-Ping Huang, Jui-Yu Chuang, Lien-Chi Chan, Cheng-Hsu Hsiao | 2006-09-26 |
| 7005720 | Semiconductor package with photosensitive chip and fabrication method thereof | Chien-Ping Huang, Cheng-Hsu Hsiao | 2006-02-28 |
| 6989296 | Fabrication method of semiconductor package with photosensitive chip | Chien-Ping Huang, Cheng-Hsu Hsiao | 2006-01-24 |
| 6972216 | Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same | Chien-Ping Huang | 2005-12-06 |
| 6963135 | Semiconductor package for memory chips | Cheng-Chian Chiang, Chin-Huang Chang, Cheng-Hsu Hsiao, Min-Nan Tsai | 2005-11-08 |
| 6884652 | Semiconductor package free of substrate and fabrication method thereof | Chien-Ping Huang, Yu-Po Wang | 2005-04-26 |
| 6847104 | Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same | Chien-Ping Huang, Jui-Yu Chuang, Lien-Chi Chan | 2005-01-25 |
| 6830957 | Method of fabricating BGA packages | Han-Ping Pu, Chien-Ping Huang | 2004-12-14 |
| 6828665 | Module device of stacked semiconductor packages and method for fabricating the same | Han-Ping Pu, Chien-Ping Huang | 2004-12-07 |
| D498760 | Digital memory card | Cheng-Chia Chiang, Chin-Huang Chang, Cheng-Hsu Hsiao, Min-Nan Tsai | 2004-11-23 |
| D493799 | Digital memory card | Cheng-Chia Chiang, Chin-Huang Chang, Cheng-Hsu Hsiao, Min-Nan Tsai | 2004-08-03 |
| D492314 | IC card type circuit module | Chien-Ping Huang, Jui-Yu Chuang, Lien-Chi Chan, Cheng-Hsu Hsiao | 2004-06-29 |
| 6703698 | Semiconductor package with enhanced electrical and thermal performance and method for fabricating the same | Chien-Ping Huang | 2004-03-09 |
| 6667546 | Ball grid array semiconductor package and substrate without power ring or ground ring | Chien-Ping Huang, Eric Ko | 2003-12-23 |
| 6400014 | Semiconductor package with a heat sink | Chien-Ping Huang, Cheng-Yuan Lai, Tzu-Yi Tien | 2002-06-04 |
| 6380587 | Semiconductor read-only memory device and method of fabricating the same | Shing-Ren Sheu, Chung-Hsien Wu | 2002-04-30 |