Issued Patents All Time
Showing 26–50 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728424 | Isolation in a semiconductor device | Takashi Noma, Kazuo Okada, Hideaki Yoshimi, Shunsuke YASUDA | 2023-08-15 |
| 11646267 | Thinned semiconductor package and related methods | Takashi Noma, Francis J. Carney | 2023-05-09 |
| 11594510 | Assembly processes for semiconductor device assemblies including spacer with embedded semiconductor die | Yong Liu, Huibin Chen | 2023-02-28 |
| 11569140 | Semiconductor package with elastic coupler and related methods | Chee Hiong CHEW, Francis J. Carney | 2023-01-31 |
| 11562938 | Spacer with pattern layout for dual side cooling power module | Yong Liu, Liangbiao CHEN, Chee Hiong CHEW | 2023-01-24 |
| 11508679 | Polymer resin and compression mold chip scale package | Soon Wei WANG, Chee Hiong CHEW, Francis J. Carney | 2022-11-22 |
| 11508776 | Image sensor semiconductor packages and related methods | Larry D. Kinsman, Yu-Te HSIEH, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo | 2022-11-22 |
| 11469163 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Stephen St. Germain | 2022-10-11 |
| 11462515 | Low stress asymmetric dual side module | Chee Hiong CHEW, Atapol Prajuckamol, Stephen St. Germain | 2022-10-04 |
| 11437304 | Substrate structures and methods of manufacture | Roger P. Stout, Chee Hiong CHEW, Sadamichi Takakusaki, Francis J. Carney | 2022-09-06 |
| 11419217 | Substrate structures and methods of manufacture | Sadamichi Takakusaki | 2022-08-16 |
| 11417598 | Semiconductor package and related methods | Yenting Wen, George Chang | 2022-08-16 |
| 11404277 | Die sidewall coatings and related methods | Francis J. Carney, Michael J. Seddon, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE | 2022-08-02 |
| 11393692 | Semiconductor package electrical contact structures and related methods | Francis J. Carney, Michael J. Seddon, Takashi Noma, Eiji KUROSE | 2022-07-19 |
| 11374373 | Press-fit pin for semiconductor packages and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2022-06-28 |
| 11373939 | Quad leadframe packages and related methods | Jinchang ZHOU, Asif Y. Jakwani, Chee Hiong CHEW, Sravan VANAPARTHY, Silnore Tejero SABANDO | 2022-06-28 |
| 11367619 | Semiconductor package electrical contacts and related methods | Michael J. Seddon, Francis J. Carney, Takashi Noma, Eiji KUROSE | 2022-06-21 |
| 11348878 | Reinforced semiconductor die and related methods | Erik Nino Tolentino, Chee Hiong CHEW, Swee Har KHOR | 2022-05-31 |
| 11264264 | Solder bump formation using wafer with ring | Takashi Noma, Noboru Okubo | 2022-03-01 |
| 11257759 | Isolation in a semiconductor device | Francis J. Carney, Takashi Noma | 2022-02-22 |
| 11114402 | Semiconductor device with backmetal and related methods | Michael J. Seddon, Takashi Noma, Kazuo Okada, Hideaki Yoshimi, Naoyuki Yomoda | 2021-09-07 |
| 11075090 | Semiconductor packages and related methods | Yong Liu, Liangbiao CHEN | 2021-07-27 |
| 11075137 | High power module package structures | Jerome Teysseyre | 2021-07-27 |
| 11043420 | Fan-out wafer level packaging of semiconductor devices | George Chang, Gordon M. Grivna, Takashi Noma | 2021-06-22 |
| 10991670 | Semiconductor device assemblies including spacer with embedded semiconductor die | Yong Liu, Huibin Chen | 2021-04-27 |