Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264264 | Solder bump formation using wafer with ring | Takashi Noma, Yusheng LIN | 2022-03-01 |
| 8766408 | Semiconductor device and manufacturing method thereof | Takashi Noma, Shigeki Otsuka, Yuichi Morita, Kazuo Okada, Hiroshi Yamada +3 more | 2014-07-01 |
| 8102039 | Semiconductor device and manufacturing method thereof | Takashi Noma, Yuichi Morita, Hiroshi Yamada, Kazuo Okada, Katsuhiko Kitagawa +2 more | 2012-01-24 |
| 7986021 | Semiconductor device | Kazuo Okada, Katsuhiko Kitagawa, Takashi Noma, Shigeki Otsuka, Hiroshi Yamada +4 more | 2011-07-26 |
| 7969007 | Semiconductor device and manufacturing method thereof | Takashi Noma, Hiroyuki Shinogi | 2011-06-28 |
| 7633133 | Semiconductor device and manufacturing method of the same | Takashi Noma, Kazuo Okada, Shinzo Ishibe, Katsuhiko Kitagawa, Yuichi Morita +4 more | 2009-12-15 |
| 7589388 | Semiconductor device and method of manufacturing the same | Yuichi Morita, Takashi Noma, Hiroyuki Shinogi, Shinzo Ishibe, Katsuhiko Kitagawa +2 more | 2009-09-15 |
| 4447805 | Apparatus for measuring temperature of coke ovens | Yoshihiro Omae, Keiichi Sigyo, Hideo Nakajima, Hiroaki Fukui, Toshio Yamada +1 more | 1984-05-08 |