Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9034729 | Semiconductor device and method of manufacturing the same | Hiroshi Yamada, Kazuo Okada, Yuichi Morita, Hiroyuki Shinogi, Shinzo Ishibe +2 more | 2015-05-19 |
| 8766408 | Semiconductor device and manufacturing method thereof | Takashi Noma, Shigeki Otsuka, Yuichi Morita, Kazuo Okada, Hiroshi Yamada +3 more | 2014-07-01 |
| 8686526 | Semiconductor device and method of manufacturing the same | Hiroyuki Shinogi, Shinzo Ishibe, Hiroshi Yamada | 2014-04-01 |
| 8653612 | Semiconductor device | Kazuo Okada, Hiroshi Yamada | 2014-02-18 |
| 8653529 | Semiconductor device and method of manufacturing the same | Shinzo Ishibe | 2014-02-18 |
| 8148811 | Semiconductor device and manufacturing method thereof | Hiroyuki Shinogi, Kazuo Okada, Hiroshi Yamada | 2012-04-03 |
| 8105856 | Method of manufacturing semiconductor device with wiring on side surface thereof | Takashi Noma, Hiroyuki Shinogi, Nobuyuki Takai, Ryoji Tokushige, Takayasu Otagaki +2 more | 2012-01-31 |
| 8102039 | Semiconductor device and manufacturing method thereof | Takashi Noma, Yuichi Morita, Hiroshi Yamada, Kazuo Okada, Noboru Okubo +2 more | 2012-01-24 |
| 7986021 | Semiconductor device | Kazuo Okada, Takashi Noma, Shigeki Otsuka, Hiroshi Yamada, Shinzo Ishibe +4 more | 2011-07-26 |
| 7944015 | Semiconductor device and method of manufacturing the same | Hiroyuki Shinogi | 2011-05-17 |
| 7919875 | Semiconductor device with recess portion over pad electrode | Takashi Noma, Hisao Otsuka, Akira Suzuki, Yoshinori Seki, Yukihiro Takao +3 more | 2011-04-05 |
| 7633133 | Semiconductor device and manufacturing method of the same | Takashi Noma, Kazuo Okada, Shinzo Ishibe, Yuichi Morita, Shigeki Otsuka +4 more | 2009-12-15 |
| 7589388 | Semiconductor device and method of manufacturing the same | Yuichi Morita, Takashi Noma, Hiroyuki Shinogi, Shinzo Ishibe, Noboru Okubo +2 more | 2009-09-15 |
| 7312107 | Semiconductor device and manufacturing method thereof | Takashi Noma, Hisao Otsuka, Akira Suzuki, Yoshinori Seki, Yukihiro Takao +3 more | 2007-12-25 |
| 7312521 | Semiconductor device with holding member | Takashi Noma, Hiroyuki Shinogi, Nobuyuki Takai, Ryoji Tokushige, Takayasu Otagaki +2 more | 2007-12-25 |
| 7271466 | Semiconductor device with sidewall wiring | Takashi Noma, Hiroyuki Shinogi, Nobuyuki Takai, Ryoji Tokushige, Takayasu Otagaki +2 more | 2007-09-18 |
| 6424051 | Semiconductor device | Hiroyuki Shinogi, Nobuyuki Takai, Ryoji Tokushige | 2002-07-23 |
| 6326701 | Chip size package and manufacturing method thereof | Hiroyuki Shinogi, Nobuyuki Takai, Ryoji Tokushige, Yukihiro Takao | 2001-12-04 |
| 5145073 | Pallet for holding glass plates in standing posture | Miki Yamada | 1992-09-08 |
| 4956001 | Method and apparatus for bending and annealing glass sheets to be laminated | Takeshi Maeda | 1990-09-11 |