Issued Patents All Time
Showing 51–75 of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10897821 | Method of making single reflow power pin connections | Yushuang YAO, Atapol Prajuckamol, Chee Hiong CHEW, Francis J. Carney | 2021-01-19 |
| 10825786 | Polymer resin and compression mold chip scale package | Soon Wei WANG, Chee Hiong CHEW, Francis J. Carney | 2020-11-03 |
| 10748850 | Thinned semiconductor package and related methods | Takashi Noma, Francis J. Carney | 2020-08-18 |
| 10700018 | Reinforced semiconductor die and related methods | Erik Nino Tolentino, Chee Hiong CHEW, Swee Har KHOR | 2020-06-30 |
| 10700027 | Semiconductor copper metallization structure and related methods | — | 2020-06-30 |
| 10693270 | Press-fit pin for semiconductor packages and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2020-06-23 |
| 10651124 | Semiconductor package and related methods | Yenting Wen, George Chang | 2020-05-12 |
| 10607903 | Semiconductor package with elastic coupler and related methods | Chee Hiong CHEW, Francis J. Carney | 2020-03-31 |
| 10600736 | Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods | Takashi Noma, Shinzo Ishibe | 2020-03-24 |
| 10438932 | Semiconductor device and method of integrating power module with interposer and opposing substrates | Jinchang ZHOU, Mingjiao Liu | 2019-10-08 |
| 10396028 | Semiconductor package and related methods | Yenting Wen, George Chang | 2019-08-27 |
| 10319652 | Semiconductor package with elastic coupler and related methods | Chee Hiong CHEW, Francis J. Carney | 2019-06-11 |
| 10290672 | Image sensor semiconductor packages and related methods | Larry D. Kinsman, Yu-Te HSIEH, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo | 2019-05-14 |
| 10283466 | Polymer resin and compression mold chip scale package | Soon Wei WANG, Chee Hiong CHEW, Francis J. Carney | 2019-05-07 |
| 10231340 | Single reflow power pin connections | Yushuang YAO, Atapol Prajuckamol, Chee Hiong CHEW, Francis J. Carney | 2019-03-12 |
| 10186493 | Semiconductor copper metallization structure and related methods | — | 2019-01-22 |
| 9984968 | Semiconductor package and related methods | Yenting Wen, George Chang | 2018-05-29 |
| 9972607 | Semiconductor device and method of integrating power module with interposer and opposing substrates | Jinchang ZHOU, Mingjiao Liu | 2018-05-15 |
| 9941257 | Embedded stacked die packages and related methods | Francis J. Carney, Yenting Wen, Chee Hiong CHEW, Azhar Aripin | 2018-04-10 |
| 9905522 | Semiconductor copper metallization structure and related methods | — | 2018-02-27 |
| 9883595 | Substrate structures and methods of manufacture | Sadamichi Takakusaki | 2018-01-30 |
| 9691732 | Semiconductor package with elastic coupler and related methods | Chee Hiong CHEW, Francis J. Carney | 2017-06-27 |
| 9679878 | Embedded stacked die packages and related methods | Francis J. Carney, Yenting Wen, Chee Hiong CHEW, Azhar Aripin | 2017-06-13 |
| 9640497 | Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods | Takashi Noma, Shinzo Ishibe | 2017-05-02 |
| 9570832 | Press-fit pin for semiconductor packages and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2017-02-14 |