Issued Patents All Time
Showing 451–475 of 673 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9885855 | Photographing optical lens system, image capturing unit and electronic device | — | 2018-02-06 |
| 9882002 | FinFET with an asymmetric source/drain structure and method of making same | Hsiang-Jen Tseng, Ting-Wei Chiang, Kuo-Nan Yang, Ming-Hsiang Song, Ta-Pen Guo | 2018-01-30 |
| 9881903 | Package-on-package structure with epoxy flux residue | Chen-Hua Yu, Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +2 more | 2018-01-30 |
| 9880373 | Imaging optical lens assembly, image capturing unit and electronic device | Po-Lun Hsu | 2018-01-30 |
| 9880839 | Instruction that performs a scatter write | Guei-Yuan Lueh, Subramaniam Maiyuran, Supratim Pal | 2018-01-30 |
| 9874720 | Imaging system, image capturing apparatus and electronic device | Chun-Che Hsueh | 2018-01-23 |
| 9859258 | Semiconductor device and method of manufacture | Tien-Chung Yang, An-Jhih Su, Hsien-Wei Chen | 2018-01-02 |
| 9857563 | Optical image system, image capturing device and electronic device | Lin-Yao Liao, Chun-Che Hsueh, Chien-Shun Wu | 2018-01-02 |
| 9859245 | Chip package structure with bump and method for forming the same | Li-Hsien Huang, An-Jhih Su, Hsien-Wei Chen | 2018-01-02 |
| 9853008 | Connecting techniques for stacked CMOS devices | Hsiang-Jen Tseng, Ting-Wei Chiang, Li-Chun Tien | 2017-12-26 |
| 9837278 | Wafer level chip scale package and method of manufacturing the same | Yu-Hsiang Hu, Hung-Jui Kuo, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-12-05 |
| 9831215 | Semiconductor package and forming method thereof | Hsien-Wei Chen, Li-Hsien Huang, An-Jhih Su, Ying-Ju Chen | 2017-11-28 |
| 9825007 | Chip package structure with molding layer and method for forming the same | Li-Hsien Huang, An-Jhih Su, Hsien-Wei Chen | 2017-11-21 |
| 9812337 | Integrated circuit package pad and methods of forming | Hsien-Wei Chen, Chen-Hua Yu, Chi-Hsi Wu, Der-Chyang Yeh, An-Jhih Su | 2017-11-07 |
| 9810880 | Imaging optical system, image capturing apparatus and electronic device | Po-Lun Hsu, Cheng-Chen Lin | 2017-11-07 |
| 9806059 | Multi-stack package-on-package structures | Chi-Jung Lee, Hsien-Wei Chen, An-Jhih Su, Tien-Chung Yang, Li-Hsien Huang | 2017-10-31 |
| 9791666 | Imaging optical system, image capturing apparatus and electronic device | Dung-Yi Hsieh | 2017-10-17 |
| 9791670 | Optical lens, image capturing device and electronic device | Cheng-Chen Lin | 2017-10-17 |
| 9793231 | Under bump metallurgy (UBM) and methods of forming same | Hsien-Wei Chen, An-Jhih Su, Cheng-Hsien Hsieh | 2017-10-17 |
| 9768136 | Interconnect structure and method of fabricating same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9766433 | Photographing optical lens assembly, image capturing unit and electronic device | — | 2017-09-19 |
| 9766892 | Method and apparatus for efficient execution of nested branches on a graphics processor unit | Guei-Yuan Lueh, Subramaniam Maiyuran | 2017-09-19 |
| 9759892 | Imaging optical lens assembly, image capturing apparatus and electronic device | Chih-Wen Hsu | 2017-09-12 |
| 9761551 | Solder joint structure for ball grid array in wafer level package | Yu-Hsiang Hu, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-09-12 |
| 9733455 | Optical image lens assembly, image capturing device and electronic device | Lin-Yao Liao | 2017-08-15 |