Issued Patents All Time
Showing 426–450 of 673 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10007086 | Image capturing optical lens assembly, image capturing device and electronic device | Tung-Yi Hsieh, Hsuan-Chin Huang | 2018-06-26 |
| 9989741 | Photographing optical lens assembly, image capturing unit and electronic device | Chun-Che Hsueh, Hung-Shuo CHEN | 2018-06-05 |
| 9984998 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2018-05-29 |
| 9977225 | Photographing optical lens assembly, image capturing unit and electronic device | — | 2018-05-22 |
| 9977222 | Optical imaging lens assembly, image capturing unit and electronic device | Chun-Yen Chen, Chun-Che Hsueh, Cheng-Chen Lin | 2018-05-22 |
| 9958645 | Photographing optical lens assembly, image capturing unit and electronic device | Chun-Yen Chen, Lin-Yao Liao | 2018-05-01 |
| 9961244 | Optical image capturing system, image capturing device and electronic device | Lin-Yao Liao, Dung-Yi Hsieh | 2018-05-01 |
| 9952650 | Hardware apparatus and method for multiple processors dynamic asymmetric and symmetric mode switching | Tongzeng Yang, Anthony Mazzola | 2018-04-24 |
| 9953963 | Integrated circuit process having alignment marks for underfill | Hsien-Wei Chen, An-Jhih Su | 2018-04-24 |
| 9952412 | Imaging lens system, image capturing unit and electronic device | Chun-Che Hsueh | 2018-04-24 |
| 9941248 | Package structures, pop devices and methods of forming the same | Tien-Chung Yang, An-Jhih Su, Hsien-Wei Chen, Jo-Mei Wang | 2018-04-10 |
| 9941221 | Warpage control in package-on-package structures | Yu-Hsiang Hu, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-04-10 |
| 9935044 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Wen-Hsiung Lu, Cheng-Ting Chen, Hsuan-Ting Kuo, Ming-Da Cheng +1 more | 2018-04-03 |
| 9935067 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Ming-Da Cheng | 2018-04-03 |
| 9929071 | Dicing in wafer level package | Chia-Shen Cheng, An-Jhih Su, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen +1 more | 2018-03-27 |
| 9922938 | Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same | Ming-Horng Tsai, Chun-Chia Lee, Huan Wun Li | 2018-03-20 |
| 9922939 | Wafer level shielding in multi-stacked fan out packages and methods of forming same | Hsien-Wei Chen, An-Jhih Su, Jo-Mei Wang, Tien-Chung Yang | 2018-03-20 |
| 9905910 | Electronic device and multi-band antenna | YUEH-CHU LIN | 2018-02-27 |
| 9905911 | Antenna for electronic device | YUEH-CHU LIN | 2018-02-27 |
| 9904038 | Photographing system, image capturing unit and electronic device | — | 2018-02-27 |
| 9897785 | Image capturing lens assembly, image capturing device and vehicle photographing terminal | Cheng-Chen Lin | 2018-02-20 |
| 9892869 | Electrochemically activated C-MEMS electrodes for on-chip micro-supercapacitors | Majid Beidaghi, Chunlei Wang | 2018-02-13 |
| 9886734 | Techniques for graphics data prefetching | Guei-Yuan Lueh, Subramaniam Maiyuran | 2018-02-06 |
| 9888509 | Method and apparatus for performing a random access (RA) procedure for device to-device (D2D) service in a wireless communication system | Li-Te Pan, Li-Chih Tseng | 2018-02-06 |
| 9888527 | Systems for processing semiconductor devices, and methods of processing semiconductor devices | Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2018-02-06 |