Issued Patents All Time
Showing 51–70 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7391086 | Conductive contacts and methods for fabricating conductive contacts for elctrochemical planarization of a work piece | Francisco Juarez, Henner Meinhold | 2008-06-24 |
| 7341946 | Methods for the electrochemical deposition of copper onto a barrier layer of a work piece | Sridhar Karthik Kailasam, Jonathan D. Reid, Eric G. Webb, Johanes H. Sukamto | 2008-03-11 |
| 7211509 | Method for enhancing the nucleation and morphology of ruthenium films on dielectric substrates using amine containing compounds | Sanjay Gopinath, Jeremie J. Dalton, Jason M. Blackburn, Willibrordus Gerardus Maria van den Hoek | 2007-05-01 |
| 7041596 | Surface treatment using iodine plasma to improve metal deposition | Jeremie J. Dalton, Sanjay Gopinath, Jason M. Blackburn | 2006-05-09 |
| 6790773 | Process for forming barrier/seed structures for integrated circuits | Ronald A. Powell | 2004-09-14 |
| 6774039 | Process scheme for improving electroplating performance in integrated circuit manufacture | — | 2004-08-10 |
| 6764168 | Sensor for detecting droplet characteristics | Henner Meinhold, Mark L. Rea, Sachin M. Chinchwadkar, Fred J. Chetcuti | 2004-07-20 |
| 6756307 | Apparatus for electrically planarizing semiconductor wafers | John C. Kelly, Wilbert van den Hoek | 2004-06-29 |
| 6743661 | Method of fabricating an integrated circuit package utilizing an interposer surrounded by a flexible dielectric material with conductive posts | — | 2004-06-01 |
| 6719886 | Method and apparatus for ionized physical vapor deposition | Glyn Reynolds, Derrek Andrew Russell, Jozef Brcka, Mirko Vukovic, Michael Grapperhaus +2 more | 2004-04-13 |
| 6709565 | Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation | Steven T. Mayer, Robert J. Contolini, Eliot K. Broadbent | 2004-03-23 |
| 6699396 | Methods for electroplating large copper interconnects | — | 2004-03-02 |
| 6652711 | Inductively-coupled plasma processing system | Jozef Brcka, Michael Grapperhaus, Gerrit J. Leusink, Glyn Reynolds, Mirko Vukovic +1 more | 2003-11-25 |
| 6620736 | Electrostatic control of deposition of, and etching by, ionized materials in semiconductor processing | — | 2003-09-16 |
| 6537421 | RF bias control in plasma deposition and etch systems with multiple RF power sources | — | 2003-03-25 |
| 6525407 | Integrated circuit package | — | 2003-02-25 |
| 6417626 | Immersed inductively—coupled plasma source | Jozef Brcka, Michael Grapperhaus, Gerrit J. Leusink, Glyn Reynolds, Mirko Vukovic +1 more | 2002-07-09 |
| 6287435 | Method and apparatus for ionized physical vapor deposition | Glyn Reynolds, Derrek Andrew Russell, Jozef Brcka, Mirko Vukovic, Michael Grapperhaus +2 more | 2001-09-11 |
| 6197165 | Method and apparatus for ionized physical vapor deposition | Thomas J. Licata | 2001-03-06 |
| 6080287 | Method and apparatus for ionized physical vapor deposition | Thomas J. Licata | 2000-06-27 |