Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916429 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, Chih-Pin Hung, Chen-Chao Wang | 2021-02-09 |
| 10886263 | Stacked semiconductor package assemblies including double sided redistribution layers | John Richard Hunt, Chih-Pin Hung, Chen-Chao Wang, Chih-Yi Huang | 2021-01-05 |
| 10535521 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, Chih-Pin Hung, Chen-Chao Wang | 2020-01-14 |
| 10515806 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, Chih-Pin Hung, Chen-Chao Wang | 2019-12-24 |
| 10276382 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, Chih-Pin Hung, Chen-Chao Wang | 2019-04-30 |
| 8399776 | Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package | Bernd Karl Appelt, Calvin Chun Long CHEUNG, Shih-Fu Huang, Yuan-Chang Su, Chia-Cheng Chen +1 more | 2013-03-19 |
| 7227268 | Placement of sacrificial solder balls underneath the PBGA substrate | Chi-Shih Chang, Ajit K. Trivedi | 2007-06-05 |
| 7199438 | Overmolded optical package | Bernd Karl Appelt | 2007-04-03 |
| 7026012 | Method and apparatus for forming a metallic feature on a substrate | Peter Malcolm Moran | 2006-04-11 |
| 6891274 | Under-bump-metallurgy layer for improving adhesion | Ho-Ming Tong, Chun-Chi Lee, Su Tao, Jeng-Da Wu, Chih-Huang Chang +1 more | 2005-05-10 |
| 6863936 | Method of forming selective electroless plating on polymer surfaces | Peter Malcolm Moran, Harvey Phillips | 2005-03-08 |
| 6864168 | Bump and fabricating process thereof | Ho-Ming Tong, Chun-Chi Lee, Su Tao, Chih-Huang Chang, Jeng-Da Wu +2 more | 2005-03-08 |
| 6838806 | Vibratory in-plane tunneling gyroscope | Bee Lee Chua, Holden King Ho Li, Yuan Xu, Francis Eng Hock Tay | 2005-01-04 |
| 6829149 | Placement of sacrificial solder balls underneath the PBGA substrate | Chi-Shih Chang, Ajit K. Trivedi | 2004-12-07 |
| 6819002 | Under-ball-metallurgy layer | Ho-Ming Tong, Chun-Chi Lee, Su Tao, Jeng-Da Wu, Chih-Huang Chang +1 more | 2004-11-16 |
| 6429530 | Miniaturized chip scale ball grid array semiconductor package | — | 2002-08-06 |
| 6403882 | Protective cover plate for flip chip assembly backside | Michael A. Gaynes, Eric A. Johnson, Tien Y. Wu | 2002-06-11 |
| 6358627 | Rolling ball connector | Joseph A. Benenati, Claude L. Bertin, Thomas Edward Dinan, Wayne F. Ellis, Wayne J. Howell +4 more | 2002-03-19 |
| 6353182 | Proper choice of the encapsulant volumetric CTE for different PGBA substrates | Chi-Shih Chang, Ajit K. Trivedi | 2002-03-05 |
| 6258627 | Underfill preform interposer for joining chip to substrate | Joseph A. Benenati, Lisa A. Fanti, Wayne J. Howell, John U. Knickerbocker | 2001-07-10 |
| 6255599 | Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination | Chi-Shih Chang, Ajit K. Trivedi | 2001-07-03 |
| 6214642 | Area array stud bump flip chip device and assembly process | Syamal Kumar Lahiri | 2001-04-10 |
| 6177729 | Rolling ball connector | Joseph A. Benenati, Claude L. Bertin, Thomas Edward Dinan, Wayne F. Ellis, Wayne J. Howell +4 more | 2001-01-23 |
| 6013355 | Testing laminates with x-ray moire interferometry | Douglas H. Strope, Natalie B. Feilchenfeld, Yifan Guo, George Dean Ogden | 2000-01-11 |
| 5959348 | Construction of PBGA substrate for flip chip packing | Chi-Shih Chang, Ajit K. Trivedi | 1999-09-28 |