Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244917 | Multilayer pillar for reduced stress interconnect and method of making same | Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof | 2022-02-08 |
| 11171102 | Multilayer pillar for reduced stress interconnect and method of making same | Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof | 2021-11-09 |
| 11094657 | Multilayer pillar for reduced stress interconnect and method of making same | Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof | 2021-08-17 |
| 10699972 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | William E. Bernier, Timothy H. Daubenspeck, Valerie Oberson, David L. Questad | 2020-06-30 |
| 10403590 | Multilayer pillar for reduced stress interconnect and method of making same | Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof | 2019-09-03 |
| 10396051 | Multilayer pillar for reduced stress interconnect and method of making same | Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof | 2019-08-27 |
| 10037062 | Thermal venting device with pressurized plenum | Siddharth Bhopte, Daniel J. Dummer, Andrew Douglas Delano | 2018-07-31 |
| 9899279 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | William E. Bernier, Timothy H. Daubenspeck, Valerie Oberson, David L. Questad | 2018-02-20 |
| 9640501 | Multilayer pillar for reduced stress interconnect and method of making same | Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof | 2017-05-02 |
| 9472520 | Multilayer pillar for reduced stress interconnect and method of making same | Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof | 2016-10-18 |
| 9366591 | Determining magnitude of compressive loading | Paul F. Bodenweber, Steven P. Ostrander, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz | 2016-06-14 |
| 9111816 | Multilayer pillar for reduced stress interconnect and method of making same | Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof | 2015-08-18 |
| 8957531 | Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity | William E. Bernier, Timothy H. Daubenspeck, Valerie Oberson, David L. Questad | 2015-02-17 |
| 8794079 | Determining magnitude of compressive loading | Paul F. Bodenweber, Steven P. Ostrander, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz | 2014-08-05 |
| 8717043 | Determining thermal interface material (TIM) thickness change | Paul F. Bodenweber, Kamal K. Sikka, Jiantao Zheng, Jeffrey A. Zitz | 2014-05-06 |
| 8421217 | Achieving mechanical and thermal stability in a multi-chip package | Jon A. Casey, John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Roger A. Liptak +4 more | 2013-04-16 |
| 8293587 | Multilayer pillar for reduced stress interconnect and method of making same | Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof | 2012-10-23 |
| 8202765 | Achieving mechanical and thermal stability in a multi-chip package | Jon A. Casey, John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Roger A. Liptak +4 more | 2012-06-19 |
| 7952207 | Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening | Jayshree Shah, Kamalesh K. Srivastava | 2011-05-31 |
| 7875972 | Semiconductor device assembly having a stress-relieving buffer layer | Kamal K. Sikka, Jiantao Zheng | 2011-01-25 |
| 7819027 | Method and structure for a pull test for controlled collapse chip connections and ball limiting metallurgy | Vijayeshwar D. Khanna, David C. Long, David L. Questad | 2010-10-26 |
| 7812438 | Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging | David L. Questad, Kamal K. Sikka, Xiaojin Wei, Jiantao Zheng | 2010-10-12 |
| 7088008 | Electronic package with optimized circuitization pattern | David J. Alcoe, William Infantolino | 2006-08-08 |
| 6703704 | Stress reducing stiffener ring | David J. Alcoe, Kim J. Blackwell | 2004-03-09 |