TJ

Thomas E. Spikes, Jr.

AM AMD: 32 patents #292 of 9,279Top 4%
AP Advanced Microdevices Pvt: 1 patents #2 of 26Top 8%
Overall (All Time): #104,087 of 4,157,543Top 3%
34
Patents All Time

Issued Patents All Time

Showing 25 most recent of 34 patents

Patent #TitleCo-InventorsDate
6599174 Eliminating dishing non-uniformity of a process layer 2003-07-29
6555396 Method and apparatus for enhancing endpoint detection of a via etch Ailian Zhao, John A. Iacoponi 2003-04-29
6458678 Transistor formed using a dual metal process for gate and source/drain region Frederick N. Hause, David Wu 2002-10-01
6326251 Method of making salicidation of source and drain regions with metal gate MOSFET Mark I. Gardner, H. Jim Fulford 2001-12-04
6309936 Integrated formation of LDD and non-LDD semiconductor devices Mark I. Gardner, Robert Paiz 2001-10-30
6271112 Interlayer between titanium nitride and high density plasma oxide Christopher Wooten, Craig W. Christian, Allen L. Evans, Tim Z. Hossain 2001-08-07
6239476 Integrated circuit isolation structure employing a protective layer and method for making same Mark I. Gardner, H. Jim Fulford 2001-05-29
6228724 Method of making high performance MOSFET with enhanced gate oxide integration and device formed thereby Mark I. Gardner, H. Jim Fulford 2001-05-08
6225201 Ultra short transistor channel length dictated by the width of a sidewall spacer Mark I. Gardner, Derrick J. Wristers, Jon D. Cheek 2001-05-01
6211000 Method of making high performance mosfets having high conductivity gate conductors Mark I. Gardner, H. Jim Fulford 2001-04-03
6194283 High density trench fill due to new spacer fill method including isotropically etching silicon nitride spacers Mark I. Gardner, Robert Paiz 2001-02-27
6171917 Transistor sidewall spacers composed of silicon nitride CVD deposited from a high density plasma source Sey-Ping Sun, Fred N. Hause 2001-01-09
6160316 Integrated circuit utilizing an air gap to reduce capacitance between adjacent metal linewidths Mark I. Gardner, Robert Paiz 2000-12-12
6140190 Method and structure for elevated source/drain with polished gate electrode insulated gate field effect transistors Mark I. Gardner, Michael Duane 2000-10-31
6140163 Method and apparatus for upper level substrate isolation integrated with bulk silicon Mark I. Gardner, Daniel Kadosh 2000-10-31
6124174 Spacer structure as transistor gate Mark I. Gardner 2000-09-26
6114219 Method of manufacturing an isolation region in a semiconductor device using a flowable oxide-generating material Sey-Ping Sun, Robert Dawson 2000-09-05
6110785 Formulation of high performance transistors using gate trim etch process Mark I. Gardner, Anthony J. Toprac 2000-08-29
6100204 Method of making ultra thin gate oxide using aluminum oxide Mark I. Gardner, Mark C. Gilmer 2000-08-08
6074904 Method and structure for isolating semiconductor devices after transistor formation Mark W. Michael, Mark I. Gardner, Robert Dawson 2000-06-13
6064102 Semiconductor device having gate electrodes with different gate insulators and fabrication thereof Mark I. Gardner, H. Jim Fulford 2000-05-16
6048766 Flash memory device having high permittivity stacked dielectric and fabrication thereof Mark I. Gardner, Mark C. Gilmer 2000-04-11
6037244 Method of manufacturing a semiconductor device using advanced contact formation Mark I. Gardner, Robert Paiz, Frederick N. Hause, Sey-Ping Sun 2000-03-14
5981354 Semiconductor fabrication employing a flowable oxide to enhance planarization in a shallow trench isolation process Fred N. Hause, Daniel Kadosh 1999-11-09
5970375 Semiconductor fabrication employing a local interconnect Mark I. Gardner, Daniel Kadosh 1999-10-19