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Run-to-run control method for automated control of metal deposition processes |
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Control mechanism for matching process parameters in a multi-chamber process tool |
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Method and apparatus for run-to-run control of deposition process |
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Advanced process control (APC) of copper thickness for chemical mechanical planarization (CMP) optimization |
James Stice |
2003-10-07 |
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2003-01-28 |
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2002-12-31 |
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2002-10-22 |
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Method for controlling optical properties of antireflective coatings |
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2002-06-11 |
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Semicondutor having selectively enhanced field oxide areas and method for producing same |
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Integrated circuit fabrication using a metal silicide having a sputterdeposited metal nitride layer |
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Method for forming a silicide using ion beam mixing |
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Method for low energy implantation of argon to control titanium silicide formation |
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1995-08-22 |
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Germanium implant for use with ultra-shallow junctions |
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1995-03-28 |
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Method of fabricating semiconductor gate electrode with fluorine migration barrier |
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1995-02-28 |
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Method of making a semiconductor having selectively enhanced field oxide areas |
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1994-12-13 |