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Methodology of implementing ultra high temperature (UHT) anneal in fabricating devices that contain sige |
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Run-to-run control method for automated control of metal deposition processes |
Thomas J. Sonderman, Craig W. Christian |
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Method and apparatus for controlling wafer thickness uniformity in a multi-zone vertical furnace |
William J. Campbell, Thomas J. Sonderman, Elfido Coss, Jr. |
2005-02-01 |
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Control of two-step gate etch process |
Matthew A. Purdy, James H. Hussey, Jr., Douglas J. Bonser |
2004-05-11 |
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Method and apparatus for controlling focus based on a thickness of a layer of photoresist |
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Method for adjusting incoming film thickness uniformity such that variations across the film after polishing minimized |
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2003-04-08 |
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Method and apparatus for the integration of sensor data from a process tool in an advanced process control (APC) framework |
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Method and apparatus for controlling optical-parameters in a stepper |
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2002-07-09 |