Issued Patents All Time
Showing 1–25 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11168234 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Mary E. Rothwell, Willi Volksen +1 more | 2021-11-09 |
| 10796958 | 3D integration method using SOI substrates and structures produced thereby | Roy R. Yu | 2020-10-06 |
| 10777454 | 3D integration method using SOI substrates and structures produced thereby | Roy R. Yu | 2020-09-15 |
| 10767084 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Mary E. Rothwell, Willi Volksen +1 more | 2020-09-08 |
| 10651086 | 3D integration method using SOI substrates and structures produced thereby | Roy R. Yu | 2020-05-12 |
| 10340182 | Enhanced via fill material and processing for dual damscene integration | James P. Doyle, Geraud Jean-Michel Dubois, Nicholas C. M. Fuller, Teddie Peregrino Magbitang, Robert D. Miller +1 more | 2019-07-02 |
| 9994741 | Enhanced adhesive materials and processes for 3D applications | James L. Hedrick, Robert D. Miller, Deborah A. Neumayer, Mary E. Rothwell, Willi Volksen +1 more | 2018-06-12 |
| 9412620 | Three-dimensional integrated circuit device fabrication including wafer scale membrane | Douglas C. La Tulipe, Jr., James Vichiconti | 2016-08-09 |
| 9218956 | Capping coating for 3D integration applications | Anna W. Topol | 2015-12-22 |
| 9111925 | Process for enhanced 3D integration and structures generated using the same | Evan G. Colgan, Roy R. Yu | 2015-08-18 |
| 9089080 | Corrugated interfaces for multilayered interconnects | Lawrence A. Clevenger, Timothy J. Dalton, Elbert E. Huang, Carl Radens | 2015-07-21 |
| 9064717 | Lock and key through-via method for wafer level 3D integration and structures produced thereby | Mary E. Rothwell, Ghavam G. Shahidi, Roy R. Yu | 2015-06-23 |
| 8963278 | Three-dimensional integrated circuit device using a wafer scale membrane | Douglas C. La Tulipe, Jr., James Vichiconti | 2015-02-24 |
| 8962448 | Computer readable medium encoded with a program for fabricating 3D integrated circuit device using interface wafer as permanent carrier | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more | 2015-02-24 |
| 8927087 | Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed | Kuan-Neng Chen, Bruce K. Furman, David L. Rath, Anna W. Topol, Cornelia K. Tsang | 2015-01-06 |
| 8912050 | Capping coating for 3D integration applications | Anna W. Topol | 2014-12-16 |
| 8901741 | Interconnect structures with engineered dielectrics with nanocolumnar porosity | Matthew E. Colburn, Satya V. Nitta, Charles T. Black, Kathryn Guarini | 2014-12-02 |
| 8828521 | Corrugated interfaces for multilayered interconnects | Lawrence A. Clevenger, Timothy J. Dalton, Elbert E. Huang, Carl Radens | 2014-09-09 |
| 8778736 | Capping coating for 3D integration applications | Anna W. Topol | 2014-07-15 |
| 8738167 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Roy R. Yu | 2014-05-27 |
| 8664081 | Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Fei Liu +2 more | 2014-03-04 |
| 8637953 | Wafer scale membrane for three-dimensional integrated circuit device fabrication | Douglas C. La Tulipe, Jr., James Vichiconti | 2014-01-28 |
| 8629553 | 3D integrated circuit device fabrication with precisely controllable substrate removal | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Steven J. Koester, Roy R. Yu | 2014-01-14 |
| 8623741 | Homogeneous porous low dielectric constant materials | Geraud Jean-Michel Dubois, Teddie Peregrino Magbitang, Willi Volksen, Theo J. Frot | 2014-01-07 |
| 8617689 | Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formed | Kuan-Neng Chen, Bruce K. Furman, David L. Rath, Anna W. Topol, Cornelia K. Tsang | 2013-12-31 |