| 7678258 |
Void-free damascene copper deposition process and means of monitoring thereof |
Panayotis Andricacos, Dean S. Chung, Hariklia Deligianni, James E. Fluegel, Keith Kwietniak +4 more |
2010-03-16 |
| 7227265 |
Electroplated copper interconnection structure, process for making and electroplating bath |
Panayotis Andricacos, Steven H. Boettcher, Dean S. Chung, Hariklia Deligianni, James E. Fluegel +6 more |
2007-06-05 |
| 7078247 |
Early detection of contact liner integrity by chemical reaction |
Lawrence Bauer, Jr., Kenneth J. Giewont, Subramanian S. Iyer, Bosang Kim, Jeffrey Lloyd +4 more |
2006-07-18 |
| 6979393 |
Method for plating copper conductors and devices formed |
Kenneth P. Rodbell, Panayotis Andricacos, Cyril Cabral, Jr., Lynne M. Gignac, Cyprian Emeka Uzoh |
2005-12-27 |
| 6660330 |
Method for depositing metal films onto substrate surfaces utilizing a chamfered ring support |
Sandra G. Malhotra, Fenton R. McFeely, Andrew H. Simon, John J. Yurkas |
2003-12-09 |
| 6627052 |
Electroplating apparatus with vertical electrical contact |
James E. Fluegel, Yuet-Ying Yu |
2003-09-30 |
| 6600230 |
Seedlayer for plating metal in deep submicron structures |
Cyprian Emeka Uzoh |
2003-07-29 |
| 6592747 |
Method of controlling additives in copper plating baths |
Wilma Jean Horkans, Keith Kwietniak |
2003-07-15 |
| 6471845 |
Method of controlling chemical bath composition in a manufacturing environment |
John O. Dukovic, William E. Corbin, Jr., Erick G. Walton, Panayotis Andricacos, James E. Fluegel +2 more |
2002-10-29 |
| 6413854 |
Method to build multi level structure |
Cyprian Emeka Uzoh, Daniel C. Edelstein, Cheryl G. Faltermeier |
2002-07-02 |
| 6368484 |
Selective plating process |
Richard P. Volant, Kevin S. Petrarca, David M. Rockwell, Seshadri Subbanna |
2002-04-09 |
| 6344125 |
Pattern-sensitive electrolytic metal plating |
Kevin S. Petrarca, Seshadri Subbanna, Richard P. Volant |
2002-02-05 |
| 6344129 |
Method for plating copper conductors and devices formed |
Kenneth P. Rodbell, Panayotis Andricacos, Cyril Cabral, Jr., Lynne M. Gignac, Cyprian Emeka Uzoh |
2002-02-05 |
| 6333120 |
Method for controlling the texture and microstructure of plated copper and plated structure |
Patrick W. DeHaven, Kenneth P. Rodbell, Cyprian Emeka Uzoh |
2001-12-25 |
| 6331237 |
Method of improving contact reliability for electroplating |
Panayotis Andricacos, W. Jean Horkans, Keith Kwietniak, Cyprian Emeka Uzoh |
2001-12-18 |
| 6270646 |
Electroplating apparatus and method using a compressible contact |
Erick G. Walton, Dean S. Chung, Lara Sandra Collins, William E. Corbin, Jr., Hariklia Deligianni +4 more |
2001-08-07 |
| 6258717 |
Method to produce high quality metal fill in deep submicron vias and lines |
Cyprian Emeka Uzoh |
2001-07-10 |
