Issued Patents All Time
Showing 25 most recent of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334413 | System in package with flip chip die over multi-layer heatsink stanchion | Kelly M. Lear, Jeffrey Miller, Christine Blair | 2025-06-17 |
| 12094831 | High density interconnect device and method | Mathew J. Manusharow | 2024-09-17 |
| 12087656 | Package architecture utilizing wafer to wafer bonding | Anthony M. Chiu, Robert Charles Dry | 2024-09-10 |
| 12002762 | High density organic bridge device and method | Stefanie M. Lotz, Wei-Lun Kane Jen | 2024-06-04 |
| 11942391 | System in package with flip chip die over multi-layer heatsink stanchion | Kelly M. Lear, Jeffrey Miller, Christine Blair | 2024-03-26 |
| 11664320 | High density interconnect device and method | Mathew J. Manusharow | 2023-05-30 |
| 11637050 | Package architecture utilizing wafer to wafer bonding | Anthony M. Chiu, Robert Charles Dry | 2023-04-25 |
| 11608564 | Helical plated through-hole package inductor | William J. Lambert, Mathew J. Manusharow, Yikang Deng | 2023-03-21 |
| 11443970 | Methods of forming a package substrate | Manohar S. Konchady, Tao Wu, Wei-Lun Kane Jen, Yi Li | 2022-09-13 |
| 11158578 | High density interconnect device and method | Mathew J. Manusharow | 2021-10-26 |
| 10998120 | Method of making an inductor | William J. Lambert, Mathew J. Manusharow, Yikang Deng | 2021-05-04 |
| 10971416 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more | 2021-04-06 |
| 10734282 | Substrate conductor structure and method | Harold Ryan Chase, Mathew J. Manusharow, Mark S. Hlad | 2020-08-04 |
| 10672713 | High density organic bridge device and method | Stefanie M. Lotz, Wei-Lun Kane Jen | 2020-06-02 |
| 10629469 | Solder resist layers for coreless packages and methods of fabrication | Manohar S. Konchady, Tao Wu, Wei-Lun Kane Jen, Yi Li | 2020-04-21 |
| 10446499 | High density interconnect device and method | Mathew J. Manusharow | 2019-10-15 |
| 10410939 | Package power delivery using plane and shaped vias | Krishna Bharath, Mathew J. Manusharow, Adel A. Elsherbini, Aleksandar Aleksov, Yidnekachew S. Mekonnen +4 more | 2019-09-10 |
| 10312007 | Inductor formed in substrate | Mathew J. Manusharow, Harold Ryan Chase | 2019-06-04 |
| 10163557 | Helical plated through-hole package inductor | William J. Lambert, Mathew J. Manusharow, Yikang Deng | 2018-12-25 |
| 10121701 | Substrate conductor structure and method | Harold Ryan Chase, Mathew J. Manusharow, Mark S. Hlad | 2018-11-06 |
| 10103105 | High density organic bridge device and method | Stefanie M. Lotz, Wei-Lun Kane Jen | 2018-10-16 |
| 10085341 | Direct chip attach using embedded traces | Mathew J. Manusharow | 2018-09-25 |
| 10028394 | Electrical interconnect formed through buildup process | Matthew J Manusharow | 2018-07-17 |
| 9999129 | Microelectronic device and method of manufacturing same | John S. Guzek, Brent M. Roberts | 2018-06-12 |
| 9917044 | Package with bi-layered dielectric structure | Zheng Zhou, Chong Zhang, Kyu Oh Lee, Amanda E. Schuckman | 2018-03-13 |