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Method and apparatus for cleaning a semiconductor substrate |
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Method for removing material from semiconductor wafer and apparatus for performing the same |
Mikhail Korolik, Michael Ravkin, Fritz Redeker, John M. Boyd |
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Method and apparatus for cleaning a semiconductor substrate |
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Proximity head heating method and apparatus |
Katrina Mikhaylichenko |
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Proximity head heating method and apparatus |
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Method of preventing pattern collapse during rinsing and drying |
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System and method for a combined contact and non-contact wafer cleaning module |
Katrina Mikhaylichenko, Michael Ravkin |
2010-06-29 |
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Seokmin Yun, John M. Boyd, Mark Wilcoxson |
2009-08-04 |
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Enhanced wafer cleaning method |
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2008-02-12 |
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System and method for a combined contact and non-contact wafer cleaning module |
Katrina Mikhaylichenko, Michael Ravkin |
2006-03-07 |
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Katrina Mikhaylichenko, Michael Ravkin |
2005-09-27 |
| 6857435 |
Method and apparatus for cooling a resonator of a megasonic transducer |
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Substrate processing using a fluid re-circulation system in a wafer scrubbing system |
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Drying a substrate using a combination of substrate processing technologies |
Michael Ravkin, Katrina Mikhaylichenko |
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Method and apparatus for cooling a resonator of a megasonic transducer |
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Fluid delivery stablization for wafer preparation systems |
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Method and apparatus for cleaning edges of contaminated substrates |
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Organic preclean for improving vapor phase wafer etch uniformity |
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