Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11331691 | Apparatus and method of manufacturing tow prepreg | Yong Min Park, No Hyun Park, Yean Jung Jeong | 2022-05-17 |
| 11271225 | Thermal-activated pressure relief device for fuel cell vehicle | Jeong Hyun Ham, Yong Joo CHO, Ki Ho Hwang | 2022-03-08 |
| 11085584 | High-pressure composite container having gastight nozzle structure | Ki Ho Hwang, Young-min Choi | 2021-08-10 |
| 10767814 | Pressure vessel equipped with permeated gas discharging structure | Hyun Lee, Ki Ho Hwang, Gye Hyoung YOO, Seok Heo, Jong Lyul Kim | 2020-09-08 |
| 10274132 | Multi-sealed nozzle and pressure vessel including the same | Chang-Ho Kim, Ki Ho Hwang, Seok Heo, Jong Lyul Kim, Do Yeun Kim | 2019-04-30 |
| 10047910 | Apparatus for fastening gas vessel and manufacturing method of the same | — | 2018-08-14 |
| 9656543 | Fuel gas tank manufacturing method | — | 2017-05-23 |
| 9656612 | Apparatus for fastening pressure vessel of vehicle and pressure vessel fastening system | — | 2017-05-23 |
| 9142481 | Integrated circuit packaging system with heatsink cap and method of manufacture thereof | Gwangjin Kim, JoungIn Yang, DokOk Yu, Hoon Jung | 2015-09-22 |
| 9093415 | Integrated circuit packaging system with heat spreader and method of manufacture thereof | Oh Han Kim, Sell Jung, HeeSoo Lee, YoungChul Kim | 2015-07-28 |
| 8710634 | Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof | HeeJo Chi, Junwoo Myung, Yeonglm Park, HyungMin Lee | 2014-04-29 |
| 8247894 | Integrated circuit package system with step mold recess | In Sang Yoon, HanGil Shin, DeokKyung Yang | 2012-08-21 |
| 8093100 | Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof | A Leam Choi, DeokKyung Yang, HyungSang Park | 2012-01-10 |
| 8067831 | Integrated circuit package system with planar interconnects | Hyeog Chan Kwon, Tae Sung Jeong, Taeg Ki Lim, Jong Wook Ju | 2011-11-29 |
| 7875967 | Integrated circuit with step molded inner stacking module package in package system | DeokKyung Yang, In Sang Yoon | 2011-01-25 |
| 7859099 | Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof | A Leam Choi, DeokKyung Yang, HyungSang Park | 2010-12-28 |
| 7687920 | Integrated circuit package-on-package system with central bond wires | DeokKyung Yang, Hyun Joung Kim | 2010-03-30 |
| 7445962 | Stacked integrated circuits package system with dense routability and high thermal conductivity | Bongsuk Choi, Keon Teak Kang | 2008-11-04 |